Christopher D. Combs

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface structure method and apparatus associated with compute or e...
- Patent number 10,573,580
- Issue date Feb 25, 2020
- Intel Corporation
- Srinivasa R. Aravamudhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for identifying lead-free solder
- Patent number 7,251,880
- Issue date Aug 7, 2007
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered heat sink anchor and method of use
- Patent number 7,183,496
- Issue date Feb 27, 2007
- Intel Corporation
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-shrinkable retainer for PCB double-sided assembly
- Patent number 7,131,193
- Issue date Nov 7, 2006
- Intel Corporation
- Arjang Fartash
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension mechanism and method for assembling overhanging components
- Patent number 6,917,524
- Issue date Jul 12, 2005
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-shrinkable retainer for PCB double-sided assembly
- Patent number 6,906,268
- Issue date Jun 14, 2005
- Intel Corporation
- Arjang Fartash
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retainer for circuit board assembly and method for using the same
- Patent number 6,875,931
- Issue date Apr 5, 2005
- Intel Corporation
- Christopher D. Combs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero mounting force solder-free connector/component and method
- Patent number 6,817,878
- Issue date Nov 16, 2004
- Intel Corporation
- Christopher D. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extension mechanism and method for assembling overhanging components
- Patent number 6,801,436
- Issue date Oct 5, 2004
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer to couple a microelectronic device package to a circuit...
- Patent number 6,791,035
- Issue date Sep 14, 2004
- Intel Corporation
- Thomas E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy washer for retention of inverted SMT components
- Patent number 6,791,189
- Issue date Sep 14, 2004
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero insertion force heat-activated retention pin
- Patent number 6,764,325
- Issue date Jul 20, 2004
- Intel Corporation
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered heat sink anchor and method of use
- Patent number 6,734,371
- Issue date May 11, 2004
- Intel Corporation
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retainer for circuit board assembly and method for using the same
- Patent number 6,700,800
- Issue date Mar 2, 2004
- Intel Corporation
- Christopher Combs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for retaining assembled components
- Patent number 6,691,407
- Issue date Feb 17, 2004
- Intel Corporation
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and electronic board products utilizing endothermic materia...
- Patent number 6,651,869
- Issue date Nov 25, 2003
- Intel Corporation
- Raiyomand F. Aspandiar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component placement
- Patent number 6,523,801
- Issue date Feb 25, 2003
- Intel Corporation
- Christopher D. Combs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink mounting with shock absorbers
- Patent number 6,501,658
- Issue date Dec 31, 2002
- Intel Corporation
- Tom E. Pearson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with embedded thermocouple junctions
- Patent number 6,472,612
- Issue date Oct 29, 2002
- Intel Corporation
- Arjang Fartash
- G01 - MEASURING TESTING
Information Patent Grant
Plastic package with pull tab
- Patent number D456249
- Issue date Apr 30, 2002
- Intel Corporation
- Tom E. Pearson
- D09 - Packages and containers for goods

Patents Applicationslast 30 patents

Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20210082798
- Publication date Mar 18, 2021
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES TO REDUCE SUBSTRATE REFLOW WARPAGE
- Publication number 20190103289
- Publication date Apr 4, 2019
- Intel Corporation
- Christopher David Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE STRUCTURE METHOD AND APPARATUS ASSOCIATED WITH COMPUTE OR E...
- Publication number 20180288877
- Publication date Oct 4, 2018
- Intel Corporation
- Srinivasa R. Aravamudhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Extension mechanism and method for assembling overhanging components
- Publication number 20050014419
- Publication date Jan 20, 2005
- Tom E. Pearson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldered heat sink anchor and method of use
- Publication number 20040207076
- Publication date Oct 21, 2004
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-shrinkable retainer for PCB double-sided assembly
- Publication number 20040209508
- Publication date Oct 21, 2004
- Arjang Fartash
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Built up lands
- Publication number 20040124006
- Publication date Jul 1, 2004
- Tom E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Retainer for circuit board assembly and method for using the same
- Publication number 20040011557
- Publication date Jan 22, 2004
- Christopher D. Combs
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Interposer to couple a microelectronic device package to a circuit...
- Publication number 20040003496
- Publication date Jan 8, 2004
- Intel Corporation
- Thomas E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
RETAINER FOR CIRCUIT BOARD ASSEMBLY AND METHOD FOR USING THE SAME
- Publication number 20030231481
- Publication date Dec 18, 2003
- Christopher Combs
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Zero insertion force heat-activated retention pin
- Publication number 20030216066
- Publication date Nov 20, 2003
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interposer to couple a microelectronic device package to a circuit...
- Publication number 20030156396
- Publication date Aug 21, 2003
- Thomas E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Zero mounting force solder-free connector/component and method
- Publication number 20030124885
- Publication date Jul 3, 2003
- Christopher D. Combs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Epoxy washer for retention of inverted SMT components
- Publication number 20030111259
- Publication date Jun 19, 2003
- Tom E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Heat-shrinkable retainer for PCB double-sided assembly
- Publication number 20030111260
- Publication date Jun 19, 2003
- Arjang Fartash
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Epoxy washer for retention of inverted SMT components
- Publication number 20030111258
- Publication date Jun 19, 2003
- Tom E. Pearson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and structure for identifying lead-free solder
- Publication number 20030062192
- Publication date Apr 3, 2003
- Tom E. Pearson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Soldered heat sink anchor and method of use
- Publication number 20030062195
- Publication date Apr 3, 2003
- George Arrigotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extension mechanism and method for assembling overhanging components
- Publication number 20030061709
- Publication date Apr 3, 2003
- Tom E. Pearson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Methods and electronic board products utilizing endothermic materia...
- Publication number 20030057265
- Publication date Mar 27, 2003
- Raiyomand F. Aspandiar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Component placement
- Publication number 20020171025
- Publication date Nov 21, 2002
- Christopher D. Combs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED THERMOCOUPLE JUNCTIONS
- Publication number 20020139575
- Publication date Oct 3, 2002
- Arjang Fartash
- G01 - MEASURING TESTING
Information Patent Application
Heatsink mounting with shock absorbers
- Publication number 20020114137
- Publication date Aug 22, 2002
- Tom E. Pearson
- H01 - BASIC ELECTRIC ELEMENTS

Christopher D. Combs

Person

Patents Grantslast 30 patents

Varied ball ball-grid-array (BGA) packages

Surface structure method and apparatus associated with compute or e...

Method and structure for identifying lead-free solder

Soldered heat sink anchor and method of use

Heat-shrinkable retainer for PCB double-sided assembly

Extension mechanism and method for assembling overhanging components

Heat-shrinkable retainer for PCB double-sided assembly

Retainer for circuit board assembly and method for using the same

Zero mounting force solder-free connector/component and method

Extension mechanism and method for assembling overhanging components

Interposer to couple a microelectronic device package to a circuit...

Epoxy washer for retention of inverted SMT components

Zero insertion force heat-activated retention pin

Soldered heat sink anchor and method of use

Retainer for circuit board assembly and method for using the same

Methods for retaining assembled components

Methods and electronic board products utilizing endothermic materia...

Component placement

Heatsink mounting with shock absorbers

Printed circuit board with embedded thermocouple junctions

Plastic package with pull tab

Patents Applicationslast 30 patents

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

TECHNIQUES TO REDUCE SUBSTRATE REFLOW WARPAGE

SURFACE STRUCTURE METHOD AND APPARATUS ASSOCIATED WITH COMPUTE OR E...

Extension mechanism and method for assembling overhanging components

Soldered heat sink anchor and method of use

Heat-shrinkable retainer for PCB double-sided assembly

Built up lands

Retainer for circuit board assembly and method for using the same

Interposer to couple a microelectronic device package to a circuit...

RETAINER FOR CIRCUIT BOARD ASSEMBLY AND METHOD FOR USING THE SAME

Zero insertion force heat-activated retention pin

Interposer to couple a microelectronic device package to a circuit...

Zero mounting force solder-free connector/component and method

Epoxy washer for retention of inverted SMT components

Heat-shrinkable retainer for PCB double-sided assembly

Epoxy washer for retention of inverted SMT components

Method and structure for identifying lead-free solder

Soldered heat sink anchor and method of use

Extension mechanism and method for assembling overhanging components

Methods and electronic board products utilizing endothermic materia...

Component placement

PRINTED CIRCUIT BOARD WITH EMBEDDED THERMOCOUPLE JUNCTIONS

Heatsink mounting with shock absorbers