Christopher Daniel Manack

Person

Lantana, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Efficient redistribution layer topology
- Patent number 12,142,586
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members for die attach in flip chip packages
- Patent number 12,100,678
- Issue date Sep 24, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach surface copper layer with protective layer for microelec...
- Patent number 12,074,096
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating for thermal management
- Patent number 12,068,221
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Three dimensional package for semiconductor devices and external co...
- Patent number 12,062,597
- Issue date Aug 13, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with metal stop ring outside the scribe seal
- Patent number 12,009,319
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,978,709
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 11,942,386
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC having a metal ring thereon for stress reduction
- Patent number 11,869,820
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
- Patent number 11,854,922
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packages with visible solder fillets
- Patent number 11,855,024
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Qiao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor dies
- Patent number 11,837,518
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front side laser-based wafer dicing
- Patent number 11,664,276
- Issue date May 30, 2023
- Texas Instruments Incorporated
- Matthew John Sherbin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional package for semiconductor devices and external co...
- Patent number 11,631,632
- Issue date Apr 18, 2023
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for electronic device
- Patent number 11,616,038
- Issue date Mar 28, 2023
- Texas Instruments Incorporated
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,594,504
- Issue date Feb 28, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 11,587,858
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package including undermounted die with exposed backs...
- Patent number 11,562,949
- Issue date Jan 24, 2023
- Texas Instruments Incorporated
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc layer for a semiconductor die pillar
- Patent number 11,443,996
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brass-coated metals in flip-chip redistribution layers
- Patent number 11,410,947
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC having a metal ring thereon for stress reduction
- Patent number 11,387,155
- Issue date Jul 12, 2022
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient redistribution layer topology
- Patent number 11,380,637
- Issue date Jul 5, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated system-in-package with radiation shielding
- Patent number 11,362,047
- Issue date Jun 14, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flipchip package with an IC having a covered cavity comprising meta...
- Patent number 11,362,020
- Issue date Jun 14, 2022
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanostructure barrier for copper wire bonding
- Patent number 11,127,515
- Issue date Sep 21, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with conversion coating
- Patent number 11,121,076
- Issue date Sep 14, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel alloy for semiconductor packaging
- Patent number 11,011,483
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zinc-cobalt barrier for interface in solder bond applications
- Patent number 11,011,488
- Issue date May 18, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with leadframe having pre-singulated leads or...
- Patent number 10,840,211
- Issue date Nov 17, 2020
- Texas Instruments Incorporated
- Bradley Andrew Glasscock
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES
- Publication number 20240413114
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-LASER DICING WAFER-LEVEL TESTING
- Publication number 20240332078
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael T. WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20240234231
- Publication date Jul 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED SEMICONDUCTOR DIES
- Publication number 20240055313
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTR...
- Publication number 20230387036
- Publication date Nov 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...
- Publication number 20230352373
- Publication date Nov 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REMOVAL OF STREET TEST DEVICES DURING WAFER DICING
- Publication number 20230274978
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT SIDE LASER-BASED WAFER DICING
- Publication number 20230260839
- Publication date Aug 17, 2023
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW JOHN SHERBIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS
- Publication number 20230065075
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zinc Layer For A Semiconductor Die Pillar
- Publication number 20230005807
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DRILLED MOLD CAVITY
- Publication number 20220415762
- Publication date Dec 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...
- Publication number 20220406673
- Publication date Dec 22, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20220384375
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC HAVING A METAL RING THEREON FOR STRESS REDUCTION
- Publication number 20220336304
- Publication date Oct 20, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20220328438
- Publication date Oct 13, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
- Publication number 20220285293
- Publication date Sep 8, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...
- Publication number 20220208655
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
- Publication number 20220173062
- Publication date Jun 2, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURE SENSOR CAVITIES
- Publication number 20220155109
- Publication date May 19, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIPCHIP PACKAGE WITH AN IC HAVING A COVERED CAVITY COMPRISING META...
- Publication number 20220157698
- Publication date May 19, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED SEMICONDUCTOR DIES
- Publication number 20220068744
- Publication date Mar 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20220059423
- Publication date Feb 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH CONVERSION COATING
- Publication number 20220005760
- Publication date Jan 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERMOUNTED DIE WITH EXPOSED BACKS...
- Publication number 20210398882
- Publication date Dec 23, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Patrick Francis Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
- Publication number 20210384150
- Publication date Dec 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING
- Publication number 20210327829
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS
- Publication number 20210280547
- Publication date Sep 9, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NIckel Alloy for Semiconductor Packaging
- Publication number 20210242151
- Publication date Aug 5, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH METAL STOP RING OUTSIDE THE SCRIBE SEAL
- Publication number 20210210440
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS

Christopher Daniel Manack

Person

Patents Grantslast 30 patents

Efficient redistribution layer topology

Conductive members for die attach in flip chip packages

Die attach surface copper layer with protective layer for microelec...

Plating for thermal management

Three dimensional package for semiconductor devices and external co...

Integrated circuit with metal stop ring outside the scribe seal

Method of forming brass-coated metals in flip-chip redistribution l...

Integrated system-in-package with radiation shielding

Electronic devices in semiconductor package cavities

IC having a metal ring thereon for stress reduction

Semicondutor package substrate with die cavity and redistribution l...

Wafer chip scale packages with visible solder fillets

Coated semiconductor dies

Front side laser-based wafer dicing

Three dimensional package for semiconductor devices and external co...

Interconnect for electronic device

Nickel alloy for semiconductor packaging

Zinc-cobalt barrier for interface in solder bond applications

Semiconductor package including undermounted die with exposed backs...

Zinc layer for a semiconductor die pillar

Brass-coated metals in flip-chip redistribution layers

IC having a metal ring thereon for stress reduction

Efficient redistribution layer topology

Integrated system-in-package with radiation shielding

Flipchip package with an IC having a covered cavity comprising meta...

Nanostructure barrier for copper wire bonding

Semiconductor die with conversion coating

Nickel alloy for semiconductor packaging

Zinc-cobalt barrier for interface in solder bond applications

Semiconductor package with leadframe having pre-singulated leads or...

Patents Applicationslast 30 patents

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

CONDUCTIVE MEMBERS FOR DIE ATTACH IN FLIP CHIP PACKAGES

POST-LASER DICING WAFER-LEVEL TESTING

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

COATED SEMICONDUCTOR DIES

LASER ABLATION FOR DIE SEPARATION TO REDUCE LASER SPLASH AND ELECTR...

THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...

EFFICIENT REMOVAL OF STREET TEST DEVICES DURING WAFER DICING

FRONT SIDE LASER-BASED WAFER DICING

WAFER CHIP SCALE PACKAGES WITH VISIBLE SOLDER FILLETS

Zinc Layer For A Semiconductor Die Pillar

SEMICONDUCTOR PACKAGE WITH DRILLED MOLD CAVITY

SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION L...

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

IC HAVING A METAL RING THEREON FOR STRESS REDUCTION

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING

THREE DIMENSIONAL PACKAGE FOR SEMICONDUCTOR DEVICES AND EXTERNAL CO...

MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS

MINIATURE SENSOR CAVITIES

FLIPCHIP PACKAGE WITH AN IC HAVING A COVERED CAVITY COMPRISING META...

COATED SEMICONDUCTOR DIES

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

SEMICONDUCTOR DIE WITH CONVERSION COATING

SEMICONDUCTOR PACKAGE INCLUDING UNDERMOUNTED DIE WITH EXPOSED BACKS...

EFFICIENT REDISTRIBUTION LAYER TOPOLOGY

INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDING

ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS

NIckel Alloy for Semiconductor Packaging

INTEGRATED CIRCUIT WITH METAL STOP RING OUTSIDE THE SCRIBE SEAL