Christopher J. Bahr

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Maricopa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
System, apparatus, and method for advanced solder bumping
- Patent number 7,790,598
- Issue date Sep 7, 2010
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System, apparatus, and method for advanced solder bumping
- Patent number 7,517,788
- Issue date Apr 14, 2009
- Intel Corporation
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM, APPARATUS, AND METHOD FOR ADVANCED SOLDER BUMPING
- Publication number 20090196000
- Publication date Aug 6, 2009
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System, apparatus, and method for advanced solder bumping
- Publication number 20070152024
- Publication date Jul 5, 2007
- Mengzhi Pang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power connection for a thin film thermoelectric cooler
- Publication number 20070056620
- Publication date Mar 15, 2007
- Christopher Joseph Bahr
- H01 - BASIC ELECTRIC ELEMENTS