Christopher J. Dominic

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Westminster, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Process for exposing solder bumps on an underfill coated semiconductor
- Patent number 7,338,842
- Issue date Mar 4, 2008
- National Starch and Chemical Investment Holding Corporation
- Raghunandan Chaware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive wafers for die attach application
- Patent number 6,620,651
- Issue date Sep 16, 2003
- National Starch and Chemical Investment Holding Corporation
- Xiping He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing an electronic package by co-curing adhesive and...
- Patent number 5,972,735
- Issue date Oct 26, 1999
- National Starch and Chemical Investment Holding Corporation
- Christopher J. Dominic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process for exposing solder bumps on an underfill coated semiconductor
- Publication number 20070020815
- Publication date Jan 25, 2007
- Raghunandan Chaware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser marking passivation film for semiconductor package
- Publication number 20040145060
- Publication date Jul 29, 2004
- Christopher J. Dominic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive wafers for die attach application
- Publication number 20030087479
- Publication date May 8, 2003
- Xiping He
- H01 - BASIC ELECTRIC ELEMENTS