Christopher J. Gambee

Person

Caldwell, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 11,302,653
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with three-dimensional structures and support elements to i...
- Patent number 11,276,658
- Issue date Mar 15, 2022
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
- Patent number 11,094,684
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of roughness on a sidewall of an opening
- Patent number 10,923,478
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,896,886
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating conductive traces and resulting structures
- Patent number 10,811,313
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for enhancing adhesion of three-dimensional structures to s...
- Patent number 10,790,251
- Issue date Sep 29, 2020
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 10,748,857
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
- Patent number 10,403,618
- Issue date Sep 3, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating conductive traces and resulting structures
- Patent number 10,332,792
- Issue date Jun 25, 2019
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,262,961
- Issue date Apr 16, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,002,840
- Issue date Jun 19, 2018
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump metal structures for interconnecting semiconductor dies...
- Patent number 9,966,347
- Issue date May 8, 2018
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for backside photo alignment
- Patent number 9,741,612
- Issue date Aug 22, 2017
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump metal structures for interconnecting semiconductor dies...
- Patent number 9,704,781
- Issue date Jul 11, 2017
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures comprising at least one through-substrate...
- Patent number 9,318,438
- Issue date Apr 19, 2016
- Micron Technology, Inc.
- Mark A. Bossler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for backside photo alignment
- Patent number 9,299,663
- Issue date Mar 29, 2016
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar on pad interconnect structures, semiconductor devices includ...
- Patent number 9,129,869
- Issue date Sep 8, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of selectively removing a substrate material
- Patent number 9,034,769
- Issue date May 19, 2015
- Micron Technology, Inc.
- Mark A. Bossler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar on pad interconnect structures, semiconductor dice and die a...
- Patent number 8,659,153
- Issue date Feb 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a metal pattern
- Patent number 8,470,710
- Issue date Jun 25, 2013
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a metal pattern and semiconductor device structure
- Patent number 8,329,580
- Issue date Dec 11, 2012
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create a metal pattern using a damascene-like process
- Patent number 8,008,196
- Issue date Aug 30, 2011
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate semiconductor device structures
- Patent number 7,402,908
- Issue date Jul 22, 2008
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die Features for Self-Alignment During Die Bonding
- Publication number 20200373252
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES THREE-DIMENSIONAL STRUCTURES TO SUBSTRATES
- Publication number 20200365542
- Publication date Nov 19, 2020
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF ROUGHNESS ON A SIDEWALL OF AN OPENING
- Publication number 20200243535
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Features for Self-Alignment During Die Bonding
- Publication number 20200083178
- Publication date Mar 12, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ENHANCING ADHESION OF THREE-DIMENIONAL STRUCTURES TO SU...
- Publication number 20190393176
- Publication date Dec 26, 2019
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
- Publication number 20190341378
- Publication date Nov 7, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING CONDUCTIVE TRACES AND RESULTING STRUCTURES
- Publication number 20190259660
- Publication date Aug 22, 2019
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING CONDUCTIVE TRACES AND RESULTING STRUCTURES
- Publication number 20190189507
- Publication date Jun 20, 2019
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...
- Publication number 20190189576
- Publication date Jun 20, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
- Publication number 20190088637
- Publication date Mar 21, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...
- Publication number 20190051623
- Publication date Feb 14, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP METAL STRUCTURES FOR INTERCONNECTING SEMICONDUCTOR DIES...
- Publication number 20170287857
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT
- Publication number 20160172242
- Publication date Jun 16, 2016
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT
- Publication number 20150333014
- Publication date Nov 19, 2015
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structures comprising at least one through-substrate...
- Publication number 20150214160
- Publication date Jul 30, 2015
- Micron Technology, Inc.
- Mark A. Bossler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP METAL STRUCTURES FOR INTERCONNECTING SEMICONDUCTOR DIES...
- Publication number 20150137353
- Publication date May 21, 2015
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DEVICES INCLUD...
- Publication number 20140167259
- Publication date Jun 19, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELECTIVELY REMOVING A SUBSTRATE MATERIAL AND RELATED SE...
- Publication number 20140159239
- Publication date Jun 12, 2014
- Micron Technology, Inc.
- Mark A. Bossler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DICE AND DIE A...
- Publication number 20140015124
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A METAL PATTERN
- Publication number 20130005145
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A METAL PATTERN AND SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20110210451
- Publication date Sep 1, 2011
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE A METAL PATTERN USING A DAMASCENE-LIKE PROCESS
- Publication number 20080248645
- Publication date Oct 9, 2008
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to create a metal pattern using a damascene-like process and...
- Publication number 20060252225
- Publication date Nov 9, 2006
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS

Christopher J. Gambee

Person

Patents Grantslast 30 patents

Die features for self-alignment during die bonding

Devices with three-dimensional structures and support elements to i...

Edge cut debond using a temporary filler material with no adhesive...

Reduction of roughness on a sidewall of an opening

Semiconductor devices having discretely located passivation materia...

Methods of fabricating conductive traces and resulting structures

Methods for enhancing adhesion of three-dimensional structures to s...

Die features for self-alignment during die bonding

Edge cut debond using a temporary filler material with no adhesive...

Methods of fabricating conductive traces and resulting structures

Semiconductor devices having discretely located passivation materia...

Semiconductor devices having discretely located passivation materia...

Under-bump metal structures for interconnecting semiconductor dies...

Semiconductor devices and methods for backside photo alignment

Under-bump metal structures for interconnecting semiconductor dies...

Semiconductor structures comprising at least one through-substrate...

Semiconductor devices and methods for backside photo alignment

Pillar on pad interconnect structures, semiconductor devices includ...

Methods of selectively removing a substrate material

Pillar on pad interconnect structures, semiconductor dice and die a...

Methods of forming a metal pattern

Methods of forming a metal pattern and semiconductor device structure

Method to create a metal pattern using a damascene-like process

Intermediate semiconductor device structures

Patents Applicationslast 30 patents

Die Features for Self-Alignment During Die Bonding

DEVICES THREE-DIMENSIONAL STRUCTURES TO SUBSTRATES

REDUCTION OF ROUGHNESS ON A SIDEWALL OF AN OPENING

Die Features for Self-Alignment During Die Bonding

METHODS FOR ENHANCING ADHESION OF THREE-DIMENIONAL STRUCTURES TO SU...

Edge Cut Debond Using a Temporary Filler Material With No Adhesive...

METHODS OF FABRICATING CONDUCTIVE TRACES AND RESULTING STRUCTURES

METHODS OF FABRICATING CONDUCTIVE TRACES AND RESULTING STRUCTURES

SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...

Edge Cut Debond Using a Temporary Filler Material With No Adhesive...

SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...

UNDER-BUMP METAL STRUCTURES FOR INTERCONNECTING SEMICONDUCTOR DIES...

SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT

SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT

Semiconductor structures comprising at least one through-substrate...

UNDER-BUMP METAL STRUCTURES FOR INTERCONNECTING SEMICONDUCTOR DIES...

PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DEVICES INCLUD...

METHODS OF SELECTIVELY REMOVING A SUBSTRATE MATERIAL AND RELATED SE...

PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DICE AND DIE A...

METHODS OF FORMING A METAL PATTERN

METHODS OF FORMING A METAL PATTERN AND SEMICONDUCTOR DEVICE STRUCTURE

METHOD TO CREATE A METAL PATTERN USING A DAMASCENE-LIKE PROCESS

Method to create a metal pattern using a damascene-like process and...