Christopher J. Healy

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal and electromagnetic interference shielding for die embedded...
- Patent number 10,410,971
- Issue date Sep 10, 2019
- QUALCOMM Incorporated
- David Fraser Rae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package (PoP) device comprising thermal interface materi...
- Patent number 10,002,857
- Issue date Jun 19, 2018
- QUALCOMM Incorporated
- Michael James Solimando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through mold via relief gutter on molded laser package (MLP) packages
- Patent number 9,313,881
- Issue date Apr 12, 2016
- QUALCOMM Incorporated
- Christopher J. Healy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packaging with a variable thickness mold cap
- Patent number 8,753,926
- Issue date Jun 17, 2014
- QUALCOMM Incorporated
- Christopher J. Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid multilayer substrate
- Patent number 8,546,921
- Issue date Oct 1, 2013
- QUALCOMM Incorporated
- Vivek Ramadoss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing tight pitch, flip chip integrated circuit...
- Patent number 8,371,497
- Issue date Feb 12, 2013
- QUALCOMM Incorporated
- Christopher James Healy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL AND ELECTROMAGNETIC INTERFERENCE SHIELDING FOR DIE EMBEDDED...
- Publication number 20190067205
- Publication date Feb 28, 2019
- QUALCOMM Incorporated
- David Fraser RAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERI...
- Publication number 20170294422
- Publication date Oct 12, 2017
- QUALCOMM Incorporated
- Michael James Solimando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR...
- Publication number 20170271175
- Publication date Sep 21, 2017
- QUALCOMM Incorporated
- Christopher James HEALY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH MOLD VIA RELIEF GUTTER ON MOLDED LASER PACKAGE (MLP) PACKAGES
- Publication number 20140196940
- Publication date Jul 17, 2014
- QUALCOMM Incorporated
- Christopher J. Healy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Packaging With A Variable Thickness Mold Cap
- Publication number 20120061857
- Publication date Mar 15, 2012
- QUALCOMM Incorporated
- Vivek Ramadoss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Multilayer Substrate
- Publication number 20120049333
- Publication date Mar 1, 2012
- QUALCOMM Incorporated
- Vivek Ramadoss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Tight Pitch, Flip Chip Integrated Circuit...
- Publication number 20100314433
- Publication date Dec 16, 2010
- QUALCOMM Incorporated
- Christopher James Healy
- H01 - BASIC ELECTRIC ELEMENTS

Christopher J. Healy

Person

Patents Grantslast 30 patents

Thermal and electromagnetic interference shielding for die embedded...

Package on package (PoP) device comprising thermal interface materi...

Through mold via relief gutter on molded laser package (MLP) packages

Electronic packaging with a variable thickness mold cap

Hybrid multilayer substrate

Method for manufacturing tight pitch, flip chip integrated circuit...

Patents Applicationslast 30 patents

THERMAL AND ELECTROMAGNETIC INTERFERENCE SHIELDING FOR DIE EMBEDDED...

PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERI...

EXPOSED DIE MOLD UNDERFILL (MUF) WITH FINE PITCH COPPER (CU) PILLAR...

THROUGH MOLD VIA RELIEF GUTTER ON MOLDED LASER PACKAGE (MLP) PACKAGES

Electronic Packaging With A Variable Thickness Mold Cap

Hybrid Multilayer Substrate

Method for Manufacturing Tight Pitch, Flip Chip Integrated Circuit...