Christopher J. Lebeau

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for visually inspecting an object
- Patent number 6,404,912
- Issue date Jun 11, 2002
- Motorola, Inc.
- David Charles Lehnen
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for visually inspecting an object
- Patent number 6,160,906
- Issue date Dec 12, 2000
- Motorola, Inc.
- David Charles Lehnen
- G01 - MEASURING TESTING
Information Patent Grant
Method of detecting defects in semiconductor package leads
- Patent number 6,128,404
- Issue date Oct 3, 2000
- Motorola, Inc.
- Christopher J. Lebeau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer prober having an emissive display inspection system and metho...
- Patent number 6,009,187
- Issue date Dec 28, 1999
- Motorola, Inc.
- Christopher J. LeBeau
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for acquiring multiple images
- Patent number 5,982,493
- Issue date Nov 9, 1999
- Motorola, Inc.
- David Charles Lehnen
- G01 - MEASURING TESTING
Information Patent Grant
Lead coplanarity inspection apparatus and method thereof
- Patent number 5,563,703
- Issue date Oct 8, 1996
- Motorola, Inc.
- Christopher J. Lebeau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of detecting defects in semiconductor package leads
- Patent number 5,452,368
- Issue date Sep 19, 1995
- Motorola, Inc.
- Christopher J. Lebeau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bond inspection technique for a semiconductor chip
- Patent number 5,246,291
- Issue date Sep 21, 1993
- Motorola, Inc.
- Christopher J. Lebeau
- G01 - MEASURING TESTING
Information Patent Grant
Lead inspection method using a plane of light for producing reflect...
- Patent number 5,212,390
- Issue date May 18, 1993
- Motorola, Inc.
- Christopher J. LeBeau
- G01 - MEASURING TESTING
Information Patent Grant
Method for detection of defects lacking distinct edges
- Patent number 5,204,910
- Issue date Apr 20, 1993
- Motorola, Inc.
- Christopher J. Lebeau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal delay non-destructive bond integrity inspection
- Patent number 5,201,841
- Issue date Apr 13, 1993
- Motorola, Inc.
- Christopher J. Lebeau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic package inspection method
- Patent number 5,137,362
- Issue date Aug 11, 1992
- Motorola, Inc.
- Christopher J. Lebeau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for automatic semiconductor wafer inspection
- Patent number 5,129,009
- Issue date Jul 7, 1992
- Motorola, Inc.
- Christopher J. Lebeau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Automatic semiconductor package inspection method
- Patent number 5,115,475
- Issue date May 19, 1992
- Motorola, Inc.
- Christopher J. Lebeau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Automatic inspection method
- Patent number 5,012,524
- Issue date Apr 30, 1991
- Motorola, Inc.
- Christopher J. Le Beau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light diffuser
- Patent number 4,844,576
- Issue date Jul 4, 1989
- Motorola Inc.
- Christopher J. Lebeau
- G02 - OPTICS

Christopher J. Lebeau

Person

Patents Grantslast 30 patents

Method and apparatus for visually inspecting an object

Method and apparatus for visually inspecting an object

Method of detecting defects in semiconductor package leads

Wafer prober having an emissive display inspection system and metho...

Apparatus and method for acquiring multiple images

Lead coplanarity inspection apparatus and method thereof

Method of detecting defects in semiconductor package leads

Bond inspection technique for a semiconductor chip

Lead inspection method using a plane of light for producing reflect...

Method for detection of defects lacking distinct edges

Thermal delay non-destructive bond integrity inspection

Automatic package inspection method

Method for automatic semiconductor wafer inspection

Automatic semiconductor package inspection method

Automatic inspection method

Light diffuser