Christopher J. Penny

Person

Saratoga Springs, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Horizontal RRAM device and architecture for variability reduction
- Patent number 12,156,486
- Issue date Nov 26, 2024
- International Business Machines Corporation
- Timothy Mathew Philip
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 12,106,963
- Issue date Oct 1, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnect having a line with a reduced bottom dimension
- Patent number 11,990,410
- Issue date May 21, 2024
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having spacers for improved top via critical dimensio...
- Patent number 11,961,759
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with damascene line and via
- Patent number 11,894,265
- Issue date Feb 6, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal film thickness determination using angled geometric featu...
- Patent number 11,876,023
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via process with damascene metal
- Patent number 11,869,808
- Issue date Jan 9, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned top vias
- Patent number 11,854,884
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via cut fill process for line extension reduction
- Patent number 11,804,406
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lines with subtractive cuts
- Patent number 11,791,258
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device having conductive lines with air gaps therebetwee...
- Patent number 11,735,524
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ILD deposition for fully aligned via with airgap
- Patent number 11,676,854
- Issue date Jun 13, 2023
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 11,670,510
- Issue date Jun 6, 2023
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped top via for via resistance reduction
- Patent number 11,670,542
- Issue date Jun 6, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned pattern formation for a semiconductor device
- Patent number 11,646,221
- Issue date May 9, 2023
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less prefilled via formation
- Patent number 11,621,189
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via stack
- Patent number 11,600,565
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming barrier for use in air gap formation
- Patent number 11,587,830
- Issue date Feb 21, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,574,864
- Issue date Feb 7, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 11,437,317
- Issue date Sep 6, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier removal for conductor in top via integration scheme
- Patent number 11,430,735
- Issue date Aug 30, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating different width lines and spaces in a metal layer
- Patent number 11,373,880
- Issue date Jun 28, 2022
- International Business Machines Corporation
- Christopher J Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically-passive magnetic signature and identification feature wit...
- Patent number 11,351,811
- Issue date Jun 7, 2022
- International Business Machines Corporation
- Michael Rizzolo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid dielectric scheme for varying liner thickness and manganese...
- Patent number 11,348,872
- Issue date May 31, 2022
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing cost benefit and energy efficiency with modular delivery...
- Patent number 11,348,060
- Issue date May 31, 2022
- International Business Machines Corporation
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Skip via connection between metallization levels
- Patent number 11,315,827
- Issue date Apr 26, 2022
- International Business Machines Corporation
- Huai Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Language learning and speech enhancement through natural language p...
- Patent number 11,302,205
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Mahmoud Amin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Subtractive line with damascene second line type
- Patent number 11,302,575
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS
- Publication number 20240321747
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE WITHOUT LINER INTERFACE
- Publication number 20240234297
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISTACK METAL-INSULATOR-METAL (MIM) STRUCTURE USING SPACER FORMA...
- Publication number 20240222422
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20240096627
- Publication date Mar 21, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
- Publication number 20240096693
- Publication date Mar 21, 2024
- TESSERA LLC
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL HARD MASK FOR PRECISE TUNING OF MANDRELS
- Publication number 20240038535
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Joe Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...
- Publication number 20240014133
- Publication date Jan 11, 2024
- International Business Machines Corporation
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20230361023
- Publication date Nov 9, 2023
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION
- Publication number 20230335438
- Publication date Oct 19, 2023
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING VERTICALLY STACKED POWER AND GROUN...
- Publication number 20230238323
- Publication date Jul 27, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL FILM THICKNESS DETERMINATION USING ANGLED GEOMETRIC FEATU...
- Publication number 20230197531
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL ROUGHNESS EXTRACTION OF METAL
- Publication number 20230177247
- Publication date Jun 8, 2023
- International Business Machines Corporation
- GANGADHARA RAJA MUTHINTI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EARLY BACKSIDE FIRST POWER DELIVERY NETWORK
- Publication number 20230128985
- Publication date Apr 27, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA PROCESS WITH DAMASCENE METAL
- Publication number 20230094757
- Publication date Mar 30, 2023
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA CUT FILL PROCESS FOR LINE EXTENSION REDUCTION
- Publication number 20230024306
- Publication date Jan 26, 2023
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-MASK ALTERNATING LINE DEPOSITION
- Publication number 20220359394
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA ON SUBTRACTIVELY ETCHED CONDUCTIVE LINE
- Publication number 20220223473
- Publication date Jul 14, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINES WITH SUBTRACTIVE CUTS
- Publication number 20220181255
- Publication date Jun 9, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL RRAM DEVICE AND ARCHITECTURE FORE VARIABILITY REDUCTION
- Publication number 20220173313
- Publication date Jun 2, 2022
- International Business Machines Corporation
- Timothy Mathew Philip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS HAVING SPACERS FOR IMPROVED TOP VIA CRITICAL DIMENSIO...
- Publication number 20220157652
- Publication date May 19, 2022
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEPPED TOP VIA FOR VIA RESISTANCE REDUCTION
- Publication number 20220130718
- Publication date Apr 28, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED TOP VIAS
- Publication number 20220108922
- Publication date Apr 7, 2022
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATING DIFFERENT WIDTH LINES AND SPACES IN A METAL LAYER
- Publication number 20220093414
- Publication date Mar 24, 2022
- International Business Machines Corporation
- Christopher J Penny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Subtractive Line with Damascene Second Line Type
- Publication number 20220037205
- Publication date Feb 3, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECT HAVING A LINE WITH A REDUCED BOTTOM DIMENSION
- Publication number 20220028785
- Publication date Jan 27, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA STACK
- Publication number 20220028783
- Publication date Jan 27, 2022
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA WITH NEXT LEVEL LINE SELECTIVE GROWTH
- Publication number 20220005761
- Publication date Jan 6, 2022
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA WITH DAMASCENE LINE AND VIA
- Publication number 20220005732
- Publication date Jan 6, 2022
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP LAYER REMOVAL FOR CAPACITANCE REDUCTION IN DAMASCENE TOP...
- Publication number 20220005731
- Publication date Jan 6, 2022
- International Business Machines Corporation
- Christopher J. Penny
- H01 - BASIC ELECTRIC ELEMENTS

Christopher J. Penny

Person

Patents Grantslast 30 patents

Horizontal RRAM device and architecture for variability reduction

Self aligned pattern formation post spacer etchback in tight pitch...

Top via interconnect having a line with a reduced bottom dimension

Interconnects having spacers for improved top via critical dimensio...

Semiconductor device including a porous dielectric layer, and metho...

Top via with damascene line and via

Conformal film thickness determination using angled geometric featu...

Top via process with damascene metal

Fully aligned top vias

Top via with next level line selective growth

Top via cut fill process for line extension reduction

Conductive lines with subtractive cuts

Electrical device having conductive lines with air gaps therebetwee...

Selective ILD deposition for fully aligned via with airgap

Self aligned pattern formation post spacer etchback in tight pitch...

Stepped top via for via resistance reduction

Self-aligned pattern formation for a semiconductor device

Barrier-less prefilled via formation

Top via stack

Self-forming barrier for use in air gap formation

Semiconductor device including a porous dielectric layer, and metho...

Single-mask alternating line deposition

Barrier removal for conductor in top via integration scheme

Creating different width lines and spaces in a metal layer

Optically-passive magnetic signature and identification feature wit...

Hybrid dielectric scheme for varying liner thickness and manganese...

Increasing cost benefit and energy efficiency with modular delivery...

Skip via connection between metallization levels

Language learning and speech enhancement through natural language p...

Subtractive line with damascene second line type

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS

VIA STRUCTURE WITHOUT LINER INTERFACE

MULTISTACK METAL-INSULATOR-METAL (MIM) STRUCTURE USING SPACER FORMA...

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

METAL HARD MASK FOR PRECISE TUNING OF MANDRELS

STRUCTURE AND METHOD FOR MAXIMIZING AIR GAP IN BACK END OF THE LINE...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

SELF-FORMING BARRIER FOR USE IN AIR GAP FORMATION

INTERCONNECT STRUCTURE INCLUDING VERTICALLY STACKED POWER AND GROUN...

CONFORMAL FILM THICKNESS DETERMINATION USING ANGLED GEOMETRIC FEATU...

THREE-DIMENSIONAL ROUGHNESS EXTRACTION OF METAL

EARLY BACKSIDE FIRST POWER DELIVERY NETWORK

TOP VIA PROCESS WITH DAMASCENE METAL

TOP VIA CUT FILL PROCESS FOR LINE EXTENSION REDUCTION

SINGLE-MASK ALTERNATING LINE DEPOSITION

TOP VIA ON SUBTRACTIVELY ETCHED CONDUCTIVE LINE

CONDUCTIVE LINES WITH SUBTRACTIVE CUTS

HORIZONTAL RRAM DEVICE AND ARCHITECTURE FORE VARIABILITY REDUCTION

INTERCONNECTS HAVING SPACERS FOR IMPROVED TOP VIA CRITICAL DIMENSIO...

STEPPED TOP VIA FOR VIA RESISTANCE REDUCTION

FULLY ALIGNED TOP VIAS

CREATING DIFFERENT WIDTH LINES AND SPACES IN A METAL LAYER

Subtractive Line with Damascene Second Line Type

TOP VIA INTERCONNECT HAVING A LINE WITH A REDUCED BOTTOM DIMENSION

TOP VIA STACK

TOP VIA WITH NEXT LEVEL LINE SELECTIVE GROWTH

TOP VIA WITH DAMASCENE LINE AND VIA

ETCH STOP LAYER REMOVAL FOR CAPACITANCE REDUCTION IN DAMASCENE TOP...