Christopher K. Lindsey

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Lafayette, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
System for breaking a semiconductor wafer or other workpiece along...
- Patent number 8,220,685
- Issue date Jul 17, 2012
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Scribing tool and method
- Patent number 7,392,732
- Issue date Jul 1, 2008
- Micro Processing Technology, Inc.
- Paul C. Lindsey, Jr.
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...

Patents Applicationslast 30 patents

Information Patent Application
Scribing tool and method
- Publication number 20060162172
- Publication date Jul 27, 2006
- MICRO PROCESSING TECHNOLOGY, INC.
- Paul C. Lindsey
- B27 - WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL NAILING OR STAPLING MACH...