Christopher Lee Tessler

Person

Poughquag, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dicing channels for glass interposers
- Patent number 10,090,255
- Issue date Oct 2, 2018
- GLOBALFOUNDRIES Inc.
- Brittany L. Hedrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate including selectively formed barrier layer
- Patent number 9,754,823
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate including selectively formed barrier layer
- Patent number 9,748,135
- Issue date Aug 29, 2017
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill head interface with combination vacuum pressure chamber
- Patent number 9,278,401
- Issue date Mar 8, 2016
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removing material from defective opening in glass mold
- Patent number 9,254,533
- Issue date Feb 9, 2016
- GLOBALFOUNDRIES, INC.
- Jerome D. Cohen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removing material from defective opening in glass mold and related...
- Patent number 8,800,952
- Issue date Aug 12, 2014
- International Business Machines Corporation
- Jerome D. Cohen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removing material from defective opening in glass mold
- Patent number 8,237,086
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Jerome D. Cohen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dispensing assembly with a controlled gas environment
- Patent number 8,123,088
- Issue date Feb 28, 2012
- International Business Machines Corporation
- Glen Nelson Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dispensing assembly with an injector controlled gas environment
- Patent number 8,123,089
- Issue date Feb 28, 2012
- Internation Business Machines Corporation
- Glen Nelson Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making interconnect solder Pb-free bumps free from orga...
- Patent number 7,833,897
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Sarah H. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air bearing gap control for injection molded solder heads
- Patent number 7,513,410
- Issue date Apr 7, 2009
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure-only molten metal valving apparatus and method
- Patent number 7,401,637
- Issue date Jul 22, 2008
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluxless solder transfer and reflow process
- Patent number 7,332,424
- Issue date Feb 19, 2008
- International Business Machines Corporation
- Luc Bélanger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a multichip module having chips on two sides
- Patent number 6,973,715
- Issue date Dec 13, 2005
- International Business Machines Corporation
- Ajay Prabhakar Giri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for application of pressure to a workpiece by...
- Patent number 6,892,781
- Issue date May 17, 2005
- International Business Machines Corporation
- Dale C McHerron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip module having chips on two sides
- Patent number 6,765,152
- Issue date Jul 20, 2004
- International Business Machines Corporation
- Ajay Prabhakar Giri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular high frequency integrated circuit structure
- Patent number 6,413,868
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Thomas Adam Bartush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular high frequency integrated circuit structure
- Patent number 6,259,148
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Thomas Adam Bartush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation top surface reference chuck
- Patent number 5,905,566
- Issue date May 18, 1999
- International Business Machines Corporation
- Ralph R. Comulada
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Process for high contrast marking on surfaces using lasers
- Patent number 5,609,778
- Issue date Mar 11, 1997
- International Business Machines Corporation
- Doris P. Pulaski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DICING CHANNELS FOR GLASS INTERPOSERS
- Publication number 20170221837
- Publication date Aug 3, 2017
- GLOBALFOUNDRIES Inc.
- Brittany L. Hedrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER
- Publication number 20160204028
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ET...
- Publication number 20160184926
- Publication date Jun 30, 2016
- SUSS MicroTec Photonic Systems Inc.
- Courtney T. Sheets
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ETCHING SYSTEM INCLUDING MASK RETICLE FOR MULTI-DEPTH ETCHING
- Publication number 20160074968
- Publication date Mar 17, 2016
- SUSS MicroTec Photonic Systems Inc.
- Matthew E. Souter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER
- Publication number 20150357235
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER
- Publication number 20150348831
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER
- Publication number 20140224860
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXTURE PLANARITY EVALUATION METHOD
- Publication number 20140192341
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Sarah H. Knickerbocker
- G01 - MEASURING TESTING
Information Patent Application
REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD
- Publication number 20120241116
- Publication date Sep 27, 2012
- SUSS MICROTEC
- Jerome D. Cohen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD AND RELATED...
- Publication number 20120186771
- Publication date Jul 26, 2012
- SUSS Micro Tec
- Jerome D. Cohen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dispensing Assembly with a Controlled Gas Environment
- Publication number 20100084437
- Publication date Apr 8, 2010
- Glen Nelson Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dispensing Assembly with an Injector Controlled Gas Environment
- Publication number 20100084438
- Publication date Apr 8, 2010
- Glen Nelson Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD
- Publication number 20090242614
- Publication date Oct 1, 2009
- International Business Machines Corporation
- GLEN N. BIGGS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD AND RELATED...
- Publication number 20090179020
- Publication date Jul 16, 2009
- International Business Machines Corporation
- Jerome D. Cohen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD
- Publication number 20090179019
- Publication date Jul 16, 2009
- International Business Machines Corporation
- Jerome D. Cohen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGA...
- Publication number 20090020590
- Publication date Jan 22, 2009
- International Business Machines Corporation
- Sarah H. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS
- Publication number 20080302860
- Publication date Dec 11, 2008
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pressure-only molten metal valving apparatus and method
- Publication number 20080023526
- Publication date Jan 31, 2008
- International Business Machines Corporation
- Glen N. Biggs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluxless solder transfer and reflow process
- Publication number 20060035454
- Publication date Feb 16, 2006
- IBM Corporation
- Luc Belanger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multichip module having chips on two sides
- Publication number 20040118601
- Publication date Jun 24, 2004
- Ajay Prabhakar Giri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multichip module having chips on two sides
- Publication number 20040060732
- Publication date Apr 1, 2004
- International Business Machines Corporation
- Ajay Prabhakar Giri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for application of pressure to a workpiece by...
- Publication number 20030221777
- Publication date Dec 4, 2003
- International Business Machines Corporation
- Dale C. McHerron
- B30 - PRESSES

Christopher Lee Tessler

Person

Patents Grantslast 30 patents

Dicing channels for glass interposers

Substrate including selectively formed barrier layer

Substrate including selectively formed barrier layer

Fill head interface with combination vacuum pressure chamber

Removing material from defective opening in glass mold

Removing material from defective opening in glass mold and related...

Removing material from defective opening in glass mold

Dispensing assembly with a controlled gas environment

Dispensing assembly with an injector controlled gas environment

Process for making interconnect solder Pb-free bumps free from orga...

Air bearing gap control for injection molded solder heads

Pressure-only molten metal valving apparatus and method

Fluxless solder transfer and reflow process

Method of forming a multichip module having chips on two sides

Method and apparatus for application of pressure to a workpiece by...

Multichip module having chips on two sides

Modular high frequency integrated circuit structure

Modular high frequency integrated circuit structure

Laser ablation top surface reference chuck

Process for high contrast marking on surfaces using lasers

Patents Applicationslast 30 patents

DICING CHANNELS FOR GLASS INTERPOSERS

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ET...

LASER ETCHING SYSTEM INCLUDING MASK RETICLE FOR MULTI-DEPTH ETCHING

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

FILL HEAD INTERFACE WITH COMBINATION VACUUM PRESSURE CHAMBER

FIXTURE PLANARITY EVALUATION METHOD

REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD

REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD AND RELATED...

Dispensing Assembly with a Controlled Gas Environment

Dispensing Assembly with an Injector Controlled Gas Environment

METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD

REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD AND RELATED...

REMOVING MATERIAL FROM DEFECTIVE OPENING IN GLASS MOLD

PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGA...

AIR BEARING GAP CONTROL FOR INJECTION MOLDED SOLDER HEADS

Pressure-only molten metal valving apparatus and method

Fluxless solder transfer and reflow process

Multichip module having chips on two sides

Multichip module having chips on two sides

Method and apparatus for application of pressure to a workpiece by...