Christopher M. Pelto

Person

Aloha, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal insulator metal (MIM) capacitor
- Patent number 12,107,040
- Issue date Oct 1, 2024
- Intel Corporation
- Aaron J. Welsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for die stacking and associated configurations
- Patent number 11,222,863
- Issue date Jan 11, 2022
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickened stress relief and power distribution layer
- Patent number 10,229,879
- Issue date Mar 12, 2019
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside bulk silicon MEMS
- Patent number 9,850,121
- Issue date Dec 26, 2017
- Intel Corporation
- Rajashree Baskaran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D interconnect structure comprising through-silicon vias combined...
- Patent number 9,530,740
- Issue date Dec 27, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thickened stress relief and power distribution layer
- Patent number 9,496,173
- Issue date Nov 15, 2016
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnect structure comprising fine pitch single damascene ba...
- Patent number 9,449,913
- Issue date Sep 20, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside bulk silicon MEMS
- Patent number 9,196,752
- Issue date Nov 24, 2015
- Intel Corporation
- Rajashree Baskaran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D interconnect structure comprising through-silicon vias combined...
- Patent number 9,142,510
- Issue date Sep 22, 2015
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Landing structure for through-silicon via
- Patent number 8,933,564
- Issue date Jan 13, 2015
- Intel Corporation
- Christopher M. Pelto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR
- Publication number 20240395696
- Publication date Nov 28, 2024
- Intel Corporation
- Aaron J. WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR
- Publication number 20240395695
- Publication date Nov 28, 2024
- Intel Corporation
- Aaron J. WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA DIE
- Publication number 20240363490
- Publication date Oct 31, 2024
- Intel Corporation
- Mohammad Enamul KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE INTERCONNECTS FOR STITCHED DIES
- Publication number 20240222272
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER
- Publication number 20240063120
- Publication date Feb 22, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC SOURCE AND DRAIN CONTACTS FOR A THIN FILM TRANSISTOR (TF...
- Publication number 20230369503
- Publication date Nov 16, 2023
- Intel Corporation
- Cheng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULATING DIE ROTATION TO MINIMIZE AREA OVERHEAD OF RETICLE STITCH...
- Publication number 20230205094
- Publication date Jun 29, 2023
- Intel Corporation
- Scott Siers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER DIELECTRIC STACK OPTIMIZATION FOR WAFER BOW REDUCTION
- Publication number 20230207486
- Publication date Jun 29, 2023
- Intel Corporation
- Gwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DIE STACKING WITH MIXED HYBRID AND SOLDER BONDING
- Publication number 20230207525
- Publication date Jun 29, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY USING BACKSIDE POWER FOR STITCHED DIES
- Publication number 20230207565
- Publication date Jun 29, 2023
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING APPROACHES FOR STITCHED DIES
- Publication number 20230209800
- Publication date Jun 29, 2023
- Abhishek Anil SHARMA
- G11 - INFORMATION STORAGE
Information Patent Application
HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES
- Publication number 20230207445
- Publication date Jun 29, 2023
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY
- Publication number 20230197637
- Publication date Jun 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC BARRIER SURROUNDING A PLURALITY OF DIES
- Publication number 20230197638
- Publication date Jun 22, 2023
- Mohammad Enamul KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH PATTERNED THROUGH-DIELECTRIC VIAS AND R...
- Publication number 20230187362
- Publication date Jun 15, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE WITH INTERMEDIATE ROUTING LAYERS
- Publication number 20230178513
- Publication date Jun 8, 2023
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGING ARCHITECTURE WITH SOLDER AND NON-SOLDER INTERC...
- Publication number 20230170327
- Publication date Jun 1, 2023
- Intel Corporation
- Jin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER
- Publication number 20230108000
- Publication date Apr 6, 2023
- Intel Corporation
- Vishal JAVVAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL (MIM) CAPACITOR
- Publication number 20220068794
- Publication date Mar 3, 2022
- Intel Corporation
- Aaron J. WELSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR DIE STACKING AND ASSOCIATED CONFIGURATIONS
- Publication number 20210193613
- Publication date Jun 24, 2021
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER MATERIALS BETWEEN BUMPS AND PADS
- Publication number 20210057348
- Publication date Feb 25, 2021
- Intel Corporation
- Ehren HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thickened Stress Relief and Power Distribution Layer
- Publication number 20170011997
- Publication date Jan 12, 2017
- Intel Corporation
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE BULK SILICON MEMS
- Publication number 20160075551
- Publication date Mar 17, 2016
- Intel Corporation
- RAJASHREE BASKARAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...
- Publication number 20150364425
- Publication date Dec 17, 2015
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICKENED STRESS RELIEF AND POWER DISTRIBUTION LAYER
- Publication number 20150179562
- Publication date Jun 25, 2015
- Kevin J. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING STRUCTURE FOR THROUGH-SILICON VIA
- Publication number 20150137368
- Publication date May 21, 2015
- Intel Corporation
- Christopher M. Pelto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMAGE MONITOR STRUCTURE FOR THROUGH-SILICON VIA (TSV) ARRAYS
- Publication number 20140191410
- Publication date Jul 10, 2014
- Gerald S. Leatherman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LANDING STRUCTURE FOR THROUGH-SILICON VIA
- Publication number 20140175651
- Publication date Jun 26, 2014
- Christopher M. Pelto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE BULK SILICON MEMS
- Publication number 20140117470
- Publication date May 1, 2014
- Rajashree Baskaran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...
- Publication number 20130285257
- Publication date Oct 31, 2013
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Christopher M. Pelto

Person

Patents Grantslast 30 patents

Metal insulator metal (MIM) capacitor

Techniques for die stacking and associated configurations

Thickened stress relief and power distribution layer

Backside bulk silicon MEMS

3D interconnect structure comprising through-silicon vias combined...

Thickened stress relief and power distribution layer

3D interconnect structure comprising fine pitch single damascene ba...

Backside bulk silicon MEMS

3D interconnect structure comprising through-silicon vias combined...

Landing structure for through-silicon via

Patents Applicationslast 30 patents

METAL INSULATOR METAL (MIM) CAPACITOR

METAL INSULATOR METAL (MIM) CAPACITOR

THROUGH-SILICON VIA DIE

DOUBLE INTERCONNECTS FOR STITCHED DIES

PACKAGE ARCHITECTURE FOR QUASI-MONOLITHIC CHIP WITH BACKSIDE POWER

ASYMMETRIC SOURCE AND DRAIN CONTACTS FOR A THIN FILM TRANSISTOR (TF...

SIMULATING DIE ROTATION TO MINIMIZE AREA OVERHEAD OF RETICLE STITCH...

INTERLAYER DIELECTRIC STACK OPTIMIZATION FOR WAFER BOW REDUCTION

IC DIE STACKING WITH MIXED HYBRID AND SOLDER BONDING

POWER DELIVERY USING BACKSIDE POWER FOR STITCHED DIES

COOLING APPROACHES FOR STITCHED DIES

HIGH BANDWIDTH AND CAPACITY APPROACHES FOR STITCHED DIES

MOISTURE SEAL COATING OF HYBRID BONDED STACKED DIE PACKAGE ASSEMBLY

HERMETIC BARRIER SURROUNDING A PLURALITY OF DIES

PACKAGING ARCHITECTURE WITH PATTERNED THROUGH-DIELECTRIC VIAS AND R...

PACKAGING ARCHITECTURE WITH INTERMEDIATE ROUTING LAYERS

INTEGRATED PACKAGING ARCHITECTURE WITH SOLDER AND NON-SOLDER INTERC...

TOPOLOGICAL CRACK STOP (TCS) PASSIVATION LAYER

METAL INSULATOR METAL (MIM) CAPACITOR

TECHNIQUES FOR DIE STACKING AND ASSOCIATED CONFIGURATIONS

BARRIER MATERIALS BETWEEN BUMPS AND PADS

Thickened Stress Relief and Power Distribution Layer

BACKSIDE BULK SILICON MEMS

3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...

THICKENED STRESS RELIEF AND POWER DISTRIBUTION LAYER

LANDING STRUCTURE FOR THROUGH-SILICON VIA

DAMAGE MONITOR STRUCTURE FOR THROUGH-SILICON VIA (TSV) ARRAYS

LANDING STRUCTURE FOR THROUGH-SILICON VIA

BACKSIDE BULK SILICON MEMS

3D INTERCONNECT STRUCTURE COMPRISING THROUGH-SILICON VIAS COMBINED...