Christopher M. Scanlan

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip semiconductor package with integral shield and antenna
- Patent number 7,049,682
- Issue date May 23, 2006
- Amkor Technology, Inc.
- Douglas Jay Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package with integral shield and antenna
- Patent number 6,686,649
- Issue date Feb 3, 2004
- Amkor Technology, Inc.
- Douglas Jay Mathews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip integrated circuit and passive chip component package fab...
- Patent number 6,546,620
- Issue date Apr 15, 2003
- Amkor Technology, Inc.
- Frank Juskey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module package substrate fabrication method
- Patent number 6,494,361
- Issue date Dec 17, 2002
- Amkor Technology, Inc.
- Christopher Scanlan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module package substrate
- Patent number 6,445,075
- Issue date Sep 3, 2002
- Amkor Technology, Inc.
- Christopher Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having flip chip integrated circuit and passive...
- Patent number 6,356,453
- Issue date Mar 12, 2002
- Amkor Technology, Inc.
- Frank Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 5,898,128
- Issue date Apr 27, 1999
- Motorola, Inc.
- Guillermo L. Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly substrate and method of making
- Patent number 5,786,097
- Issue date Jul 28, 1998
- Motorola, Inc.
- Christopher M. Scanlan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device balancing thermal expansion coefficient mismatch
- Patent number 5,751,552
- Issue date May 12, 1998
- Motorola, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS

Christopher M. Scanlan

Person

Patents Grantslast 30 patents

Multi-chip semiconductor package with integral shield and antenna

Multi-chip semiconductor package with integral shield and antenna

Flip chip integrated circuit and passive chip component package fab...

Semiconductor module package substrate fabrication method

Semiconductor module package substrate

Electronic package having flip chip integrated circuit and passive...

Electronic component

Assembly substrate and method of making

Semiconductor device balancing thermal expansion coefficient mismatch