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Christopher M. Scanlan
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Fully molded semiconductor package for power devices and method of...
Patent number
10,818,635
Issue date
Oct 27, 2020
Deca Technologies Inc.
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced fully molded fan-out module
Patent number
10,720,417
Issue date
Jul 21, 2020
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making fully molded peripheral package on package device
Patent number
10,672,624
Issue date
Jun 2, 2020
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of unit specific progressive alignment
Patent number
10,573,601
Issue date
Feb 25, 2020
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of packaging
Patent number
10,373,870
Issue date
Aug 6, 2019
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of marking a semiconductor package
Patent number
10,373,913
Issue date
Aug 6, 2019
Deca Technologies, Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fully molded miniaturized semiconductor module
Patent number
10,373,902
Issue date
Aug 6, 2019
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of unit specific progressive alignment
Patent number
10,157,803
Issue date
Dec 18, 2018
Deca Technologies Inc.
Craig Bishop
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Automated optical inspection of unit specific patterning
Patent number
10,056,304
Issue date
Aug 21, 2018
Deca Technologies Inc.
Craig Bishop
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Fully molded peripheral package on package device
Patent number
10,050,004
Issue date
Aug 14, 2018
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
Patent number
9,978,655
Issue date
May 22, 2018
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
Patent number
9,887,103
Issue date
Feb 6, 2018
Deca Technologies, Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fully molded miniaturized semiconductor module
Patent number
9,831,170
Issue date
Nov 28, 2017
Deca Technologies, Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package in package
Patent number
9,768,124
Issue date
Sep 19, 2017
Amkor Technology, Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced fully molded fan-out module
Patent number
9,761,571
Issue date
Sep 12, 2017
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method comprising redistribution layers
Patent number
9,754,835
Issue date
Sep 5, 2017
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of marking a semiconductor package
Patent number
9,613,912
Issue date
Apr 4, 2017
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fully molded peripheral package on package device
Patent number
9,613,830
Issue date
Apr 4, 2017
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method comprising redistribution layers
Patent number
9,576,919
Issue date
Feb 21, 2017
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Front side package-level serialization for packages comprising uniq...
Patent number
9,520,364
Issue date
Dec 13, 2016
Deca Technologies Inc.
Craig Bishop
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adaptive patterning for panelized packaging
Patent number
9,520,331
Issue date
Dec 13, 2016
Deca Technologies Inc.
Christopher M. Scanlan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
3D interconnect component for fully molded packages
Patent number
9,502,397
Issue date
Nov 22, 2016
Deca Technologies, Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package in package
Patent number
9,466,545
Issue date
Oct 11, 2016
Amkor Technology, Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetically sealed wafer plating jig system and method
Patent number
9,464,362
Issue date
Oct 11, 2016
Deca Technologies Inc.
Christopher M. Scanlan
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Adaptive patterning for panelized packaging
Patent number
9,418,905
Issue date
Aug 16, 2016
Deca Technologies Inc.
Timothy L. Olson
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Automated optical inspection of unit specific patterning
Patent number
9,401,313
Issue date
Jul 26, 2016
Deca Technologies, Inc.
Craig Bishop
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
Patent number
9,397,069
Issue date
Jul 19, 2016
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die up fully molded fan-out wafer level packaging
Patent number
9,337,086
Issue date
May 10, 2016
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of land grid array packaging with b...
Patent number
9,269,622
Issue date
Feb 23, 2016
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of adaptive patterning for panelize...
Patent number
9,196,509
Issue date
Nov 24, 2015
Deca Technologies Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FULLY MOLDED SEMICONDUCTOR PACKAGE FOR POWER DEVICES AND METHOD OF...
Publication number
20190326255
Publication date
Oct 24, 2019
DECA TECHNOLOGIES INC
Timothy L. Olson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT
Publication number
20190139901
Publication date
May 9, 2019
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
Publication number
20180330966
Publication date
Nov 15, 2018
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE
Publication number
20180261586
Publication date
Sep 13, 2018
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING
Publication number
20180254216
Publication date
Sep 6, 2018
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
Publication number
20180108606
Publication date
Apr 19, 2018
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF UNIT SPECIFIC PROGRESSIVE ALIGNMENT
Publication number
20180082911
Publication date
Mar 22, 2018
DECA TECHNOLOGIES INC
Craig Bishop
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE
Publication number
20180012881
Publication date
Jan 11, 2018
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
Publication number
20170372964
Publication date
Dec 28, 2017
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
Publication number
20170256466
Publication date
Sep 7, 2017
DECA TECHNOLOGIES INC
Craig Bishop
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
Publication number
20170221830
Publication date
Aug 3, 2017
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MARKING A SEMICONDUCTOR PACKAGE
Publication number
20170186696
Publication date
Jun 29, 2017
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
Publication number
20170148755
Publication date
May 25, 2017
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED FULLY MOLDED FAN-OUT MODULE
Publication number
20170084596
Publication date
Mar 23, 2017
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY MOLDED MINIATURIZED SEMICONDUCTOR MODULE
Publication number
20170077022
Publication date
Mar 16, 2017
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
Publication number
20170033009
Publication date
Feb 2, 2017
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE IN PACKAGE
Publication number
20160379933
Publication date
Dec 29, 2016
Amkor Technology, Inc.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
Publication number
20160336241
Publication date
Nov 17, 2016
DECA TECHNOLOGIES INC
Craig Bishop
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZE...
Publication number
20160329257
Publication date
Nov 10, 2016
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D INTERCONNECT COMPONENT FOR FULLY MOLDED PACKAGES
Publication number
20160322343
Publication date
Nov 3, 2016
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
Publication number
20160260682
Publication date
Sep 8, 2016
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MARKING A SEMICONDUCTOR PACKAGE
Publication number
20160172306
Publication date
Jun 16, 2016
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AUTOMATED OPTICAL INSPECTION OF UNIT SPECIFIC PATTERNING
Publication number
20160141213
Publication date
May 19, 2016
DECA TECHNOLOGIES INC
Craig Bishop
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
Publication number
20160093580
Publication date
Mar 31, 2016
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZE...
Publication number
20160086825
Publication date
Mar 24, 2016
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FRONT SIDE PACKAGE-LEVEL SERIALIZATION FOR PACKAGES COMPRISING UNIQ...
Publication number
20160064334
Publication date
Mar 3, 2016
DECA TECHNOLOGIES INC
Craig Bishop
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ADAPTIVE PATTERNING FOR PANELIZE...
Publication number
20150364444
Publication date
Dec 17, 2015
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD COMPRISING THICKENED REDISTRIBUTION...
Publication number
20150187710
Publication date
Jul 2, 2015
DECA TECHNOLOGIES INC
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE UP FULLY MOLDED FAN-OUT WAFER LEVEL PACKAGING
Publication number
20150115456
Publication date
Apr 30, 2015
DECA TECHNOLOGIES, INC.
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF LAND GRID ARRAY PACKAGING WITH B...
Publication number
20140335658
Publication date
Nov 13, 2014
Christopher M. Scanlan
H01 - BASIC ELECTRIC ELEMENTS