Christopher P. Schaffer

Person

Long Beach, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire-less inductive devices and methods
- Patent number 8,860,543
- Issue date Oct 14, 2014
- Pulse Electronics, Inc.
- Christopher P. Schaffer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Modular electronic header assembly and methods of manufacture
- Patent number 8,845,367
- Issue date Sep 30, 2014
- Pulse Electronics, Inc.
- Aurelio J. Gutierrez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Simplified inductive devices and methods
- Patent number 8,754,734
- Issue date Jun 17, 2014
- Pulse Electronics, Inc.
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate inductive devices and methods
- Patent number 8,591,262
- Issue date Nov 26, 2013
- Pulse Electronics, Inc.
- Christopher P. Schaffer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Modular electronic header assembly and methods of manufacture
- Patent number 8,496,499
- Issue date Jul 30, 2013
- Pulse Electronics, Inc.
- Aurelio J. Gutierrez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate inductive devices and methods
- Patent number 8,234,778
- Issue date Aug 7, 2012
- Pulse Electronics, Inc.
- Christopher P. Schaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power-enabled connector assembly and method of manufacturing
- Patent number 8,118,619
- Issue date Feb 21, 2012
- Pulse Electronics, Inc.
- Christopher P. Schaffer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate inductive devices and methods
- Patent number 7,982,572
- Issue date Jul 19, 2011
- Pulse Engineering, Inc.
- Christopher P. Schaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular electronic header assembly and methods of manufacture
- Patent number 7,942,700
- Issue date May 17, 2011
- Pulse Engineering, Inc.
- Aurelio J. Gutierrez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power-enabled connector assembly and method of manufacturing
- Patent number 7,845,984
- Issue date Dec 7, 2010
- Pulse Engineering, Inc.
- Christopher P. Schaffer
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High power MCM package with improved planarity and heat dissipation
- Patent number 7,745,257
- Issue date Jun 29, 2010
- International Rectifier Corporation
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector keep-out apparatus and methods
- Patent number 7,708,602
- Issue date May 4, 2010
- Pulse Engineering, Inc.
- Thomas Rascon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-enabled connector assembly with heat dissipation apparatus an...
- Patent number 7,524,206
- Issue date Apr 28, 2009
- Pulse Engineering, Inc.
- Aurelio J. Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power MCM package with improved planarity and heat dissipation
- Patent number 7,453,146
- Issue date Nov 18, 2008
- International Rectifier Corporation
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test arrangement including anisotropic conductive film for testing...
- Patent number 7,355,431
- Issue date Apr 8, 2008
- International Rectifier Corporation
- Christopher P Schaffer
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device module with flip chip devices on a common lead...
- Patent number 7,301,235
- Issue date Nov 27, 2007
- International Rectifier Corporation
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power MCM package
- Patent number 6,946,740
- Issue date Sep 20, 2005
- International Rectifier Corporation
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device structure with metallic interlayer between s...
- Patent number 6,534,792
- Issue date Mar 18, 2003
- The Boeing Company
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device structure utilizing a diamond inlay in a pac...
- Patent number 6,489,634
- Issue date Dec 3, 2002
- The Boeing Company
- Christopher Schaffer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR ELECTRONIC HEADER ASSEMBLY AND METHODS OF MANUFACTURE
- Publication number 20140036459
- Publication date Feb 6, 2014
- Aurelio J. Gutierrez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SUBSTRATE-BASED INDUCTIVE DEVICES AND METHODS OF USING AND MANUFACT...
- Publication number 20130323974
- Publication date Dec 5, 2013
- Aurelio J. Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INDUCTIVE DEVICES AND METHODS
- Publication number 20130033353
- Publication date Feb 7, 2013
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INDUCTIVE DEVICES AND METHODS
- Publication number 20120058676
- Publication date Mar 8, 2012
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INDUCTIVE DEVICES AND METHODS
- Publication number 20120011709
- Publication date Jan 19, 2012
- Christopher P. Schaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIMPLIFIED INDUCTIVE DEVICES AND METHODS
- Publication number 20110193669
- Publication date Aug 11, 2011
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-ENABLED CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURING
- Publication number 20110074213
- Publication date Mar 31, 2011
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR ELECTRONIC HEADER ASSEMBLY AND METHODS OF MANUFACTURE
- Publication number 20100284160
- Publication date Nov 11, 2010
- Aurelio J. Gutierrez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE INDUCTIVE DEVICES AND METHODS
- Publication number 20100013589
- Publication date Jan 21, 2010
- Christopher P. Schaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER-ENABLED CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURING
- Publication number 20100009576
- Publication date Jan 14, 2010
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MCM PACKAGE WITH IMPROVED PLANARITY AND HEAT DISSIPATION
- Publication number 20090035896
- Publication date Feb 5, 2009
- International Rectifier Corporation
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector keep-out apparatus and methods
- Publication number 20080220657
- Publication date Sep 11, 2008
- Thomas Rascon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-less inductive devices and methods
- Publication number 20080186124
- Publication date Aug 7, 2008
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modular electronic header assembly and methods of manufacture
- Publication number 20070238359
- Publication date Oct 11, 2007
- Aurelio J. Gutierrez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power-enabled connector assembly and method of manufacturing
- Publication number 20070015416
- Publication date Jan 18, 2007
- Aurelio J. Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor package
- Publication number 20060202320
- Publication date Sep 14, 2006
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device module with flip chip devices on a common lead...
- Publication number 20050280163
- Publication date Dec 22, 2005
- International Rectifier Corp.
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High power MCM package with improved planarity and heat dissipation
- Publication number 20050275112
- Publication date Dec 15, 2005
- International Rectifier Corporation
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test arrangement including anisotropic conductive film for testing...
- Publication number 20050270057
- Publication date Dec 8, 2005
- International Rectifier Corporation
- Christopher P. Schaffer
- G01 - MEASURING TESTING
Information Patent Application
High power MCM package
- Publication number 20040061221
- Publication date Apr 1, 2004
- International Rectifier Corporation
- Christopher P. Schaffer
- H01 - BASIC ELECTRIC ELEMENTS

Christopher P. Schaffer

Person

Patents Grantslast 30 patents

Wire-less inductive devices and methods

Modular electronic header assembly and methods of manufacture

Simplified inductive devices and methods

Substrate inductive devices and methods

Modular electronic header assembly and methods of manufacture

Substrate inductive devices and methods

Power-enabled connector assembly and method of manufacturing

Substrate inductive devices and methods

Modular electronic header assembly and methods of manufacture

Power-enabled connector assembly and method of manufacturing

High power MCM package with improved planarity and heat dissipation

Connector keep-out apparatus and methods

Power-enabled connector assembly with heat dissipation apparatus an...

High power MCM package with improved planarity and heat dissipation

Test arrangement including anisotropic conductive film for testing...

Semiconductor device module with flip chip devices on a common lead...

High power MCM package

Microelectronic device structure with metallic interlayer between s...

Microelectronic device structure utilizing a diamond inlay in a pac...

Patents Applicationslast 30 patents

MODULAR ELECTRONIC HEADER ASSEMBLY AND METHODS OF MANUFACTURE

SUBSTRATE-BASED INDUCTIVE DEVICES AND METHODS OF USING AND MANUFACT...

SUBSTRATE INDUCTIVE DEVICES AND METHODS

SUBSTRATE INDUCTIVE DEVICES AND METHODS

SUBSTRATE INDUCTIVE DEVICES AND METHODS

SIMPLIFIED INDUCTIVE DEVICES AND METHODS

POWER-ENABLED CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURING

MODULAR ELECTRONIC HEADER ASSEMBLY AND METHODS OF MANUFACTURE

SUBSTRATE INDUCTIVE DEVICES AND METHODS

POWER-ENABLED CONNECTOR ASSEMBLY AND METHOD OF MANUFACTURING

HIGH POWER MCM PACKAGE WITH IMPROVED PLANARITY AND HEAT DISSIPATION

Connector keep-out apparatus and methods

Wire-less inductive devices and methods

Modular electronic header assembly and methods of manufacture

Power-enabled connector assembly and method of manufacturing

Power semiconductor package

Semiconductor device module with flip chip devices on a common lead...

High power MCM package with improved planarity and heat dissipation

Test arrangement including anisotropic conductive film for testing...

High power MCM package