Christopher Parfeniuk

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Midland, MI, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing SiC wafer fit for integration with power d...
- Patent number 9,279,192
- Issue date Mar 8, 2016
- Dow Corning Corporation
- Darren Hansen
- C30 - CRYSTAL GROWTH
Information Patent Grant
Flat SiC semiconductor substrate
- Patent number 9,165,779
- Issue date Oct 20, 2015
- Dow Corning Corporation
- Mark Loboda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat SiC semiconductor substrate
- Patent number 9,018,639
- Issue date Apr 28, 2015
- Dow Corning Corporation
- Mark Loboda
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SiC WAFER FIT FOR INTEGRATION WITH POWER D...
- Publication number 20160189956
- Publication date Jun 30, 2016
- Dow Corning Corporation
- Darren Hansen
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR MANUFACTURING SIC WAFER FIT FOR INTEGRATION WITH POWER D...
- Publication number 20160032486
- Publication date Feb 4, 2016
- Dow Corning Corporation
- Darren Hansen
- C30 - CRYSTAL GROWTH
Information Patent Application
FLAT SIC SEMICONDUCTOR SUBSTRATE
- Publication number 20150194319
- Publication date Jul 9, 2015
- Dow Corning Corporation
- Mark Loboda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT SIC SEMICONDUCTOR SUBSTRATE
- Publication number 20140117380
- Publication date May 1, 2014
- Dow Corning Corporation
- Mark LOBODA
- C30 - CRYSTAL GROWTH