Christopher Rosenthal

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Debonding temporarily bonded semiconductor wafers
- Patent number 9,583,374
- Issue date Feb 28, 2017
- SUSS MicroTec Lithography GmbH
- Gregory George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Debonding temporarily bonded semiconductor wafers
- Patent number 9,472,437
- Issue date Oct 18, 2016
- Suss MicroTec Lithography GmbH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Grant
Debonding temporarily bonded semiconductor wafers
- Patent number 8,950,459
- Issue date Feb 10, 2015
- Suss MicroTec Lithography GmbH
- Gregory George
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Debonding Temporarily Bonded Semiconductor Wafers
- Publication number 20160300747
- Publication date Oct 13, 2016
- SUSS MICROTEC LITHOGRAPHY GMBH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Application
Debonding Temporarily Bonded Semiconductor Wafers
- Publication number 20150101744
- Publication date Apr 16, 2015
- SUSS MICROTEC LITHOGRAPHY GMBH
- Gregory George
- B32 - LAYERED PRODUCTS
Information Patent Application
Debonding Temporarily Bonded Semiconductor Wafers
- Publication number 20130048224
- Publication date Feb 28, 2013
- Gregory George
- B32 - LAYERED PRODUCTS