Christopher S. Thomas

Person

Orem, UT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for electroless plating dispense
- Patent number 11,769,686
- Issue date Sep 26, 2023
- Intel Corporation
- Harinath Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
CMOS device with metal and silicide gate electrodes and a method fo...
- Patent number 7,883,951
- Issue date Feb 8, 2011
- Intel Corporation
- Justin K. Brask
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device using an interconnect
- Patent number 7,320,935
- Issue date Jan 22, 2008
- Intel Corporation
- Jihperng Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor device with a metal gate electrod...
- Patent number 7,220,635
- Issue date May 22, 2007
- Intel Corporation
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS device with metal and silicide gate electrodes and a method fo...
- Patent number 7,153,734
- Issue date Dec 26, 2006
- Intel Corporation
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seed layer treatment
- Patent number 7,001,641
- Issue date Feb 21, 2006
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroless introduction of interconnect structures
- Patent number 6,977,224
- Issue date Dec 20, 2005
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electroless spray deposition
- Patent number 6,843,852
- Issue date Jan 18, 2005
- Intel Corporation
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of treating an electroless plating waste
- Patent number 6,733,679
- Issue date May 11, 2004
- Intel Corporation
- Valery M. Dubin
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Interconnect structures and a method of electroless introduction of...
- Patent number 6,696,758
- Issue date Feb 24, 2004
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device using an interconnect
- Patent number 6,605,874
- Issue date Aug 12, 2003
- Intel Corporation
- Jihperng Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for monitoring file transfers and logical conn...
- Patent number 6,240,452
- Issue date May 29, 2001
- Intel Corporation
- Frank K. Welch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and apparatus for monitoring file transfers and logical conn...
- Patent number 5,862,335
- Issue date Jan 19, 1999
- Intel Corp.
- Frank K. Welch
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
METHODS & APPARATUS FOR ELECTROLESS PLATING DISPENSE
- Publication number 20210375662
- Publication date Dec 2, 2021
- Intel Corporation
- Harinath Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method For Depositing Gate Metal For CMOS Devices
- Publication number 20110147851
- Publication date Jun 23, 2011
- Christopher D. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS DEVICE WITH METAL AND SILICIDE GATE ELECTRODES AND A METHOD FO...
- Publication number 20090280608
- Publication date Nov 12, 2009
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS DEVICE WITH METAL AND SILICIDE GATE ELECTRODES AND A METHOD FO...
- Publication number 20080124857
- Publication date May 29, 2008
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making a semiconductor device with a metal gate electrod...
- Publication number 20060183277
- Publication date Aug 17, 2006
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic layer deposition of high quality high-k transition metal and...
- Publication number 20060045968
- Publication date Mar 2, 2006
- Matthew V. Metz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for improving electroplating in sub-0.1um interconnects by a...
- Publication number 20060006071
- Publication date Jan 12, 2006
- Guangli Che
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CMOS DEVICE WITH METAL AND SILICIDE GATE ELECTRODES AND A METHOD FO...
- Publication number 20050148136
- Publication date Jul 7, 2005
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seed layer treatment
- Publication number 20050112856
- Publication date May 26, 2005
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Apparatus and method for electroless spray deposition
- Publication number 20050008786
- Publication date Jan 13, 2005
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for improving electroplating in sub-0.1um interconnects by a...
- Publication number 20040245107
- Publication date Dec 9, 2004
- Guangli Che
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus to fabricate an on-chip decoupling capacitor
- Publication number 20040061197
- Publication date Apr 1, 2004
- Intel Corporation
- Bruce Block
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seed layer treatment
- Publication number 20040058139
- Publication date Mar 25, 2004
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device using an interconnect
- Publication number 20040026786
- Publication date Feb 12, 2004
- Intel Corporation
- Jihperng Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for electroless spray deposition
- Publication number 20030134047
- Publication date Jul 17, 2003
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MAKING SEMICONDUCTOR DEVICE USING AN INTERCONNECT
- Publication number 20030111729
- Publication date Jun 19, 2003
- Intel Corporation
- Jihperng Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of treating an electroless plating waste
- Publication number 20030085177
- Publication date May 8, 2003
- Valery M. Dubin
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
Interconnect structures and a method of electroless introduction of...
- Publication number 20030071355
- Publication date Apr 17, 2003
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures and a method of electroless introduction of...
- Publication number 20020084529
- Publication date Jul 4, 2002
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless method of seed layer depostion, repair, and fabrication...
- Publication number 20020064592
- Publication date May 30, 2002
- Madhav Datta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Christopher S. Thomas

Person

Patents Grantslast 30 patents

Methods and apparatus for electroless plating dispense

CMOS device with metal and silicide gate electrodes and a method fo...

Semiconductor device using an interconnect

Method for making a semiconductor device with a metal gate electrod...

CMOS device with metal and silicide gate electrodes and a method fo...

Seed layer treatment

Method of electroless introduction of interconnect structures

Apparatus and method for electroless spray deposition

Method of treating an electroless plating waste

Interconnect structures and a method of electroless introduction of...

Method of making semiconductor device using an interconnect

Method and apparatus for monitoring file transfers and logical conn...

Method and apparatus for monitoring file transfers and logical conn...

Patents Applicationslast 30 patents

METHODS & APPARATUS FOR ELECTROLESS PLATING DISPENSE

Method For Depositing Gate Metal For CMOS Devices

CMOS DEVICE WITH METAL AND SILICIDE GATE ELECTRODES AND A METHOD FO...

CMOS DEVICE WITH METAL AND SILICIDE GATE ELECTRODES AND A METHOD FO...

Method for making a semiconductor device with a metal gate electrod...

Atomic layer deposition of high quality high-k transition metal and...

Method for improving electroplating in sub-0.1um interconnects by a...

CMOS DEVICE WITH METAL AND SILICIDE GATE ELECTRODES AND A METHOD FO...

Seed layer treatment

Apparatus and method for electroless spray deposition

Method for improving electroplating in sub-0.1um interconnects by a...

Method and apparatus to fabricate an on-chip decoupling capacitor

Seed layer treatment

Semiconductor device using an interconnect

Apparatus and method for electroless spray deposition

METHOD OF MAKING SEMICONDUCTOR DEVICE USING AN INTERCONNECT

Method of treating an electroless plating waste

Interconnect structures and a method of electroless introduction of...

Interconnect structures and a method of electroless introduction of...

Electroless method of seed layer depostion, repair, and fabrication...