CHRISTOPHER W. ARGENTO

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Dripping Springs, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packages using a thermally enhanced conductive...
- Patent number 10,319,660
- Issue date Jun 11, 2019
- NXP USA, INC.
- Christopher W. Argento
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically packaged integrated circuit
- Patent number 9,484,320
- Issue date Nov 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Christopher W. Argento
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES USING A THERMALLY ENHANCED CONDUCTIVE...
- Publication number 20190252285
- Publication date Aug 15, 2019
- NXP USA, Inc.
- CHRISTOPHER W. ARGENTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES USING A THERMALLY ENHANCED CONDUCTIVE...
- Publication number 20150115432
- Publication date Apr 30, 2015
- CHRISTOPHER W. ARGENTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY PACKAGED INTEGRATED CIRCUIT
- Publication number 20130285220
- Publication date Oct 31, 2013
- CHRISTOPHER W. ARGENTO
- H01 - BASIC ELECTRIC ELEMENTS