Christopher William Johnson

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Saschey, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Reducing thermal expansion effects in semiconductor packages
- Patent number 8,809,125
- Issue date Aug 19, 2014
- Finisar Corporation
- Jose Joaquin Aizpuru
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reducing thermal expansion effects in semiconductor packages
- Patent number 7,952,108
- Issue date May 31, 2011
- Finisar Corporation
- Jose Joaquin Aizpuru
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Securing a transistor outline can within an optical component
- Patent number 7,785,930
- Issue date Aug 31, 2010
- Finisar Corporation
- Christopher William Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Securing a transistor outline can within an optical component
- Patent number 7,476,905
- Issue date Jan 13, 2009
- Finisar Corporation
- Christopher William Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDUCING THERMAL EXPANSION EFFECTS IN SEMICONDUCTOR PACKAGES
- Publication number 20110229702
- Publication date Sep 22, 2011
- Finisar Corporation
- Jose Joaquin Aizpuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURING A TRANSISTOR OUTLINE CAN WITHIN AN OPTICAL COMPONENT
- Publication number 20080311689
- Publication date Dec 18, 2008
- Finisar Corporation
- Christopher William Johnson
- G02 - OPTICS
Information Patent Application
Reducing thermal expansion effects in semiconductor packages
- Publication number 20070087174
- Publication date Apr 19, 2007
- Jose Joaquin Aizpuru
- H01 - BASIC ELECTRIC ELEMENTS