Christy S. Tyberg

Person

East Mahopac, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Toughness, adhesion and smooth metal lines of porous low K dielectr...
- Patent number RE45781
- Issue date Oct 27, 2015
- GLOBALFOUNDRIES, INC.
- Jeffrey C. Hedrick
- 001 -
Information Patent Grant
BEOL compatible FET structrure
- Patent number 8,569,803
- Issue date Oct 29, 2013
- International Business Machines Corporation
- Christy S. Tyberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically robust metal/low-k interconnects
- Patent number 8,445,377
- Issue date May 21, 2013
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BEOL compatible FET structure
- Patent number 8,441,042
- Issue date May 14, 2013
- International Business Machines Corporation
- Christy S. Tyberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reprogrammable fuse structure and method
- Patent number 8,278,155
- Issue date Oct 2, 2012
- International Business Machines Corporation
- Geoffrey W. Burr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically robust metal/low-κ interconnects
- Patent number 8,017,522
- Issue date Sep 13, 2011
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reprogrammable fuse structure and method
- Patent number 7,960,808
- Issue date Jun 14, 2011
- International Business Machines Corporation
- Geoffrey W. Burr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycarbosilane buried etch stops in interconnect structures
- Patent number 7,879,717
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Elbert E. Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for fabricating sub-lithography data tracks fo...
- Patent number 7,755,921
- Issue date Jul 13, 2010
- International Business Machines Corporation
- Solomon Assefa
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual damascene integration of ultra low dielectric constant porous...
- Patent number 7,737,561
- Issue date Jun 15, 2010
- International Business Machines Corporation
- Kaushik A Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to remove beol sacrificial materials and chemical residues b...
- Patent number 7,598,169
- Issue date Oct 6, 2009
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-shielded low power PCM-based reprogrammable eFUSE device
- Patent number 7,491,965
- Issue date Feb 17, 2009
- International Business Machines Corporation
- James P. Doyle
- G11 - INFORMATION STORAGE
Information Patent Grant
Chemical planarization performance for copper/low-k interconnect st...
- Patent number 7,407,879
- Issue date Aug 5, 2008
- International Business Machines Corporation
- Lee M Nicholson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycarbosilane buried etch stops in interconnect structures
- Patent number 7,396,758
- Issue date Jul 8, 2008
- International Business Machines Corporation
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-shielded low power PCM-based reprogrammable EFUSE device
- Patent number 7,394,089
- Issue date Jul 1, 2008
- International Business Machines Corporation
- James P. Doyle
- G11 - INFORMATION STORAGE
Information Patent Grant
Reprogrammable fuse structure and method
- Patent number 7,388,273
- Issue date Jun 17, 2008
- International Business Machines Corporation
- Geoffrey W. Burr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET structure with ultra-low K spacer
- Patent number 7,365,378
- Issue date Apr 29, 2008
- International Business Machines Corporation
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dual damascene integration of ultra low dielectric const...
- Patent number 7,338,895
- Issue date Mar 4, 2008
- International Business Machines Corporation
- Kaushik A Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric semiconductor device and process for fabricating the...
- Patent number 7,329,600
- Issue date Feb 12, 2008
- International Business Machines Corporation
- Lawrence Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycarbosilane buried etch stops in interconnect structures
- Patent number 7,187,081
- Issue date Mar 6, 2007
- International Business Machines Corporation
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line level air gaps
- Patent number 7,084,479
- Issue date Aug 1, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical planarization performance for copper/low-k interconnect st...
- Patent number 7,071,539
- Issue date Jul 4, 2006
- International Business Machines Corporation
- Lee M Nicholson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene integration of ultra low dielectric constant porous...
- Patent number 7,057,287
- Issue date Jun 6, 2006
- International Business Machines Corporation
- Kaushik A Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single and multilevel rework
- Patent number 6,982,227
- Issue date Jan 3, 2006
- International Business Machines Corporation
- Edward C. Cooney, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous low-k dielectric interconnects with improved adhesion produc...
- Patent number 6,933,586
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Ann R Fornof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reworking low-k polymers used in semiconductor structures
- Patent number 6,864,180
- Issue date Mar 8, 2005
- International Business Machines Corporation
- Darryl D. Restaino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous low-k dielectric interconnects with improved adhesion produc...
- Patent number 6,844,257
- Issue date Jan 18, 2005
- International Business Machines Corporation
- Ann R Fornof
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method to achieve reduced thermal expansion in poly...
- Patent number 6,818,285
- Issue date Nov 16, 2004
- International Business Machines Corporation
- Jeffrey C. Hedrick
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Toughness, adhesion and smooth metal lines of porous low k dielectr...
- Patent number 6,783,862
- Issue date Aug 31, 2004
- International Business Machines Corporation
- Jeffrey C Hedrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin-on cap layer, and semiconductor device containing same
- Patent number 6,724,069
- Issue date Apr 20, 2004
- International Business Machines Corporation
- Timothy Joseph Dalton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BEOL COMPATIBLE FET STRUCTURE
- Publication number 20150060856
- Publication date Mar 5, 2015
- International Business Machines Corporation
- Christy S. TYBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL COMPATIBLE FET STRUCTRURE
- Publication number 20120305929
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Christy S. Tyberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS
- Publication number 20110318942
- Publication date Dec 29, 2011
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reprogrammable Fuse Structure and Method
- Publication number 20110207286
- Publication date Aug 25, 2011
- INTERNATIONAL BUSINESS MACHINES CORP.
- Geoffrey W. Burr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL COMPATIBLE FET STRUCTURE
- Publication number 20100006850
- Publication date Jan 14, 2010
- Christy S. Tyberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS
- Publication number 20090294925
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR FABRICATING SUB-LITHOGRAPHY DATA TRACKS FO...
- Publication number 20090046493
- Publication date Feb 19, 2009
- SOLOMON ASSEFA
- G11 - INFORMATION STORAGE
Information Patent Application
POLYCARBOSILANE BURIED ETCH STOPS IN INTERCONNECT STRUCTURES
- Publication number 20080254612
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-SHIELDED LOW POWER PCM-BASED REPROGRAMMABLE EFUSE DEVICE
- Publication number 20080224118
- Publication date Sep 18, 2008
- International Business Machines Corporation
- James P. Doyle
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD TO REMOVE BEOL SACRIFICIAL MATERIALS AND CHEMICAL RESIDUES B...
- Publication number 20080200034
- Publication date Aug 21, 2008
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS
- Publication number 20080173984
- Publication date Jul 24, 2008
- International Business Machines Corporation
- Qinghuang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSFET STRUCTURE WITH ULTRA-LOW K SPACER
- Publication number 20080128766
- Publication date Jun 5, 2008
- International Business Machines Corporation
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE INTEGRATION OF ULTRA LOW DIELECTRIC CONSTANT POROUS...
- Publication number 20080099923
- Publication date May 1, 2008
- International Business Machines Corporation
- Kaushik A. Kumar
- B82 - NANO-TECHNOLOGY
Information Patent Application
HEAT-SHIELDED LOW POWER PCM-BASED REPROGRAMMABLE EFUSE DEVICE
- Publication number 20080048169
- Publication date Feb 28, 2008
- International Business Machines Corporation
- James P. Doyle
- G11 - INFORMATION STORAGE
Information Patent Application
Reprogrammable Fuse Structure and Method
- Publication number 20070290233
- Publication date Dec 20, 2007
- INTERNATIONAL BUSINESS MACHINES CORP.
- Geoffrey W. Burr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL compatible FET structure
- Publication number 20070194450
- Publication date Aug 23, 2007
- Christy S. Tyberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYCARBOSILANE BURIED ETCH STOPS IN INTERCONNECT STRUCTURES
- Publication number 20070111509
- Publication date May 17, 2007
- International Business Machines Corporation
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reprogrammable fuse structure and method
- Publication number 20060278895
- Publication date Dec 14, 2006
- International Business Machines Corporation
- Geoffrey W. Burr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line level air gaps
- Publication number 20060264036
- Publication date Nov 23, 2006
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSFET structure with ultra-low K spacer
- Publication number 20060220152
- Publication date Oct 5, 2006
- International Business Machines Corporation
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical planarization performance for copper/low-k interconnect st...
- Publication number 20060166012
- Publication date Jul 27, 2006
- INTERNATIONAL BUSINESS MACHINES CORP.
- Lee M. Nicholson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene integration of ultra low dielectric constant porous...
- Publication number 20060118961
- Publication date Jun 8, 2006
- INTERNATIONAL BUSINESS MACHINES CORP.
- Kaushik A. Kumar
- B82 - NANO-TECHNOLOGY
Information Patent Application
Low dielectric semiconductor device and process for fabricating the...
- Publication number 20050227480
- Publication date Oct 13, 2005
- International Business Machines Corporation (IBM)
- Lawrence Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Line level air gaps
- Publication number 20050127514
- Publication date Jun 16, 2005
- IBM
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene integration of ultra low dielectric constant porous...
- Publication number 20050040532
- Publication date Feb 24, 2005
- International Business Machines Corporation
- Kaushik A. Kumar
- B82 - NANO-TECHNOLOGY
Information Patent Application
Chemical planarization performance for copper/low-k interconnect st...
- Publication number 20050023689
- Publication date Feb 3, 2005
- International Business Machines Corporation
- Lee M. Nicholson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polycarbosilane buried etch stops in interconnect structures
- Publication number 20040147111
- Publication date Jul 29, 2004
- International Business Machines Corporation
- Elbert E. Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single and multilevel rework
- Publication number 20040142565
- Publication date Jul 22, 2004
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED FORMATION OF POROUS INTERCONNECTION LAYERS
- Publication number 20040130027
- Publication date Jul 8, 2004
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composition and method to achieve reduced thermal expansion in poly...
- Publication number 20040126586
- Publication date Jul 1, 2004
- Jeffrey C. Hedrick
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Christy S. Tyberg

Person

Patents Grantslast 30 patents

Toughness, adhesion and smooth metal lines of porous low K dielectr...

BEOL compatible FET structrure

Mechanically robust metal/low-k interconnects

BEOL compatible FET structure

Reprogrammable fuse structure and method

Mechanically robust metal/low-κ interconnects

Reprogrammable fuse structure and method

Polycarbosilane buried etch stops in interconnect structures

Method and apparatus for fabricating sub-lithography data tracks fo...

Dual damascene integration of ultra low dielectric constant porous...

Method to remove beol sacrificial materials and chemical residues b...

Heat-shielded low power PCM-based reprogrammable eFUSE device

Chemical planarization performance for copper/low-k interconnect st...

Polycarbosilane buried etch stops in interconnect structures

Heat-shielded low power PCM-based reprogrammable EFUSE device

Reprogrammable fuse structure and method

MOSFET structure with ultra-low K spacer

Method for dual damascene integration of ultra low dielectric const...

Low dielectric semiconductor device and process for fabricating the...

Polycarbosilane buried etch stops in interconnect structures

Line level air gaps

Chemical planarization performance for copper/low-k interconnect st...

Dual damascene integration of ultra low dielectric constant porous...

Single and multilevel rework

Porous low-k dielectric interconnects with improved adhesion produc...

Method for reworking low-k polymers used in semiconductor structures

Porous low-k dielectric interconnects with improved adhesion produc...

Composition and method to achieve reduced thermal expansion in poly...

Toughness, adhesion and smooth metal lines of porous low k dielectr...

Spin-on cap layer, and semiconductor device containing same

Patents Applicationslast 30 patents

BEOL COMPATIBLE FET STRUCTURE

BEOL COMPATIBLE FET STRUCTRURE

MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS

Reprogrammable Fuse Structure and Method

BEOL COMPATIBLE FET STRUCTURE

MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS

METHOD AND APPARATUS FOR FABRICATING SUB-LITHOGRAPHY DATA TRACKS FO...

POLYCARBOSILANE BURIED ETCH STOPS IN INTERCONNECT STRUCTURES

HEAT-SHIELDED LOW POWER PCM-BASED REPROGRAMMABLE EFUSE DEVICE

METHOD TO REMOVE BEOL SACRIFICIAL MATERIALS AND CHEMICAL RESIDUES B...

MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS

MOSFET STRUCTURE WITH ULTRA-LOW K SPACER

DUAL DAMASCENE INTEGRATION OF ULTRA LOW DIELECTRIC CONSTANT POROUS...

HEAT-SHIELDED LOW POWER PCM-BASED REPROGRAMMABLE EFUSE DEVICE

Reprogrammable Fuse Structure and Method

BEOL compatible FET structure

POLYCARBOSILANE BURIED ETCH STOPS IN INTERCONNECT STRUCTURES

Reprogrammable fuse structure and method

Line level air gaps

MOSFET structure with ultra-low K spacer

Chemical planarization performance for copper/low-k interconnect st...

Dual damascene integration of ultra low dielectric constant porous...

Low dielectric semiconductor device and process for fabricating the...

Line level air gaps

Dual damascene integration of ultra low dielectric constant porous...

Chemical planarization performance for copper/low-k interconnect st...

Polycarbosilane buried etch stops in interconnect structures

Single and multilevel rework

IMPROVED FORMATION OF POROUS INTERCONNECTION LAYERS

Composition and method to achieve reduced thermal expansion in poly...