Chu-Chin Hu

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,728,320
- Issue date Aug 15, 2023
- Mediatek Inc.
- Tien-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate substrate and fabrication method thereof
- Patent number 11,658,104
- Issue date May 23, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip package substrate
- Patent number 11,488,911
- Issue date Nov 1, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,342,316
- Issue date May 24, 2022
- Mediatek Inc.
- Tien-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating packaging substrate
- Patent number 11,031,329
- Issue date Jun 8, 2021
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 10,784,205
- Issue date Sep 22, 2020
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package substrate and associated fabrication method with varying de...
- Patent number 10,580,739
- Issue date Mar 3, 2020
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of high-voltage operation
- Patent number 10,418,480
- Issue date Sep 17, 2019
- Mediatek Inc.
- Chu-Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and conductive structure thereof
- Patent number 10,204,865
- Issue date Feb 12, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having a plurality of chips electrically connecte...
- Patent number 10,079,220
- Issue date Sep 18, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and method of fabricating the same
- Patent number 10,002,823
- Issue date Jun 19, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package substrates
- Patent number 9,831,217
- Issue date Nov 28, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and fabrication methods thereof
- Patent number 9,793,337
- Issue date Oct 17, 2017
- Mediatek Inc.
- Yuan-Fu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging module and substrate structure thereof
- Patent number 9,754,982
- Issue date Sep 5, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chun-Hsien Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 9,613,894
- Issue date Apr 4, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package apparatus and manufacturing method thereof
- Patent number 9,601,402
- Issue date Mar 21, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package apparatus and manufacturing method thereof
- Patent number 9,589,935
- Issue date Mar 7, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and fabrication methods thereof
- Patent number 9,508,786
- Issue date Nov 29, 2016
- Mediatek Inc.
- Yuan-Fu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and fabrication methods thereof
- Patent number 9,379,175
- Issue date Jun 28, 2016
- Mediatek Inc.
- Yuan-Fu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate, method for manufacturing same, and chip packag...
- Patent number 9,357,647
- Issue date May 31, 2016
- Zhen Ding Technology Co., Ltd.
- Chu-Chin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bipolar junction transistor
- Patent number 9,123,558
- Issue date Sep 1, 2015
- MediaTek Inc.
- Sheng-Hung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoresist mask-free oxide define region (ODR)
- Patent number 8,932,937
- Issue date Jan 13, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chu-Sheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package stack device and fabrication method thereof
- Patent number 8,531,021
- Issue date Sep 10, 2013
- Unimicron Technology Corporation
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier board structure with embedded semiconductor chip and fabric...
- Patent number 8,354,338
- Issue date Jan 15, 2013
- Unimicron Technology Corp.
- Chu-Chin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of package structure
- Patent number 8,222,080
- Issue date Jul 17, 2012
- Unimicron Technology Corporation
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct connection multi-chip semiconductor element structure
- Patent number 7,417,299
- Issue date Aug 26, 2008
- Phoenix Precision Technology Corporation
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for single and dual gate spacers on a semiconduc...
- Patent number 7,354,837
- Issue date Apr 8, 2008
- ProMos Technologies Inc.
- Chao-Hsi Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for pre-soldering material and fabrication method thereof
- Patent number 7,319,276
- Issue date Jan 15, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated library core for embedded passive components and method...
- Patent number 7,190,592
- Issue date Mar 13, 2007
- Phoenix Precision Technology Corporation
- Chu-Chin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for pre-soldering material and fabrication method thereof
- Patent number 7,112,524
- Issue date Sep 26, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240161957
- Publication date May 16, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Pao-Hung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
- Publication number 20240096838
- Publication date Mar 21, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED DEEP TRENCH CAPACITORS
- Publication number 20230260894
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Chu-Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERMEDIATE SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20220285257
- Publication date Sep 8, 2022
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220246591
- Publication date Aug 4, 2022
- MEDIATEK INC.
- Tien-Yu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210320096
- Publication date Oct 14, 2021
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210225822
- Publication date Jul 22, 2021
- MEDIATEK INC.
- Tien-Yu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20200135693
- Publication date Apr 30, 2020
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200075554
- Publication date Mar 5, 2020
- PHOENIX & CORPORATION
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE SUBSTRATE
- Publication number 20190341357
- Publication date Nov 7, 2019
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190206754
- Publication date Jul 4, 2019
- PHOENIX & CORPORATION
- Che-Wei Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20180240747
- Publication date Aug 23, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20180240748
- Publication date Aug 23, 2018
- PHOENIX & CORPORATION
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND ITS FABRICATION METHOD
- Publication number 20180130771
- Publication date May 10, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND ITS FABRICATION METHOD
- Publication number 20180130745
- Publication date May 10, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20170338174
- Publication date Nov 23, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Method OF A Package Substrate
- Publication number 20170317031
- Publication date Nov 2, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE SUBSTRATES
- Publication number 20170301652
- Publication date Oct 19, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF HIGH-VOLTAGE OPERATION
- Publication number 20170263761
- Publication date Sep 14, 2017
- MEDIATEK INC.
- Chu-Wei HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND ITS FABRICATION METHOD
- Publication number 20170194262
- Publication date Jul 6, 2017
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND FABRICATION METHODS THEREOF
- Publication number 20160276338
- Publication date Sep 22, 2016
- MEDIATEK INC.
- Yuan-Fu CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING MODULE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20160268326
- Publication date Sep 15, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chun-Hsien Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CONDUCTIVE STRUCTURE THEREOF
- Publication number 20160212851
- Publication date Jul 21, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20160211204
- Publication date Jul 21, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20160212852
- Publication date Jul 21, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD
- Chu-Chin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED PACKAGE STRUCTURE
- Publication number 20160192525
- Publication date Jun 30, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20160163677
- Publication date Jun 9, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- CHU-CHIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND FABRICATION METHODS THEREOF
- Publication number 20160043162
- Publication date Feb 11, 2016
- MEDIATEK INC.
- Yuan-Fu CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20150382469
- Publication date Dec 31, 2015
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- CHU-CHIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20150235916
- Publication date Aug 20, 2015
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-TUNG CHOU
- H01 - BASIC ELECTRIC ELEMENTS

Chu-Chin Hu

Person

Patents Grantslast 30 patents

Semiconductor package

Intermediate substrate and fabrication method thereof

Flip-chip package substrate

Semiconductor package

Method of fabricating packaging substrate

Electronic package

Package substrate and associated fabrication method with varying de...

Semiconductor device capable of high-voltage operation

Electronic package and conductive structure thereof

Package substrate having a plurality of chips electrically connecte...

Packaging substrate and method of fabricating the same

Method of fabricating package substrates

Integrated circuits and fabrication methods thereof

Packaging module and substrate structure thereof

Electronic package

Package apparatus and manufacturing method thereof

Package apparatus and manufacturing method thereof

Integrated circuits and fabrication methods thereof

Integrated circuits and fabrication methods thereof

Packaging substrate, method for manufacturing same, and chip packag...

Bipolar junction transistor

Photoresist mask-free oxide define region (ODR)

Package stack device and fabrication method thereof

Carrier board structure with embedded semiconductor chip and fabric...

Fabrication method of package structure

Direct connection multi-chip semiconductor element structure

Fabrication method for single and dual gate spacers on a semiconduc...

Substrate for pre-soldering material and fabrication method thereof

Integrated library core for embedded passive components and method...

Substrate for pre-soldering material and fabrication method thereof

Patents Applicationslast 30 patents

INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

COMPONENT-EMBEDDED PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE WITH INTEGRATED DEEP TRENCH CAPACITORS

INTERMEDIATE SUBSTRATE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

FLIP-CHIP PACKAGE SUBSTRATE

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

PACKAGE SUBSTRATE AND ITS FABRICATION METHOD

PACKAGE SUBSTRATE AND ITS FABRICATION METHOD

PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME

Fabrication Method OF A Package Substrate

METHOD OF FABRICATING PACKAGE SUBSTRATES

SEMICONDUCTOR DEVICE CAPABLE OF HIGH-VOLTAGE OPERATION

PACKAGE SUBSTRATE AND ITS FABRICATION METHOD

INTEGRATED CIRCUITS AND FABRICATION METHODS THEREOF

PACKAGING MODULE AND SUBSTRATE STRUCTURE THEREOF

ELECTRONIC PACKAGE AND CONDUCTIVE STRUCTURE THEREOF

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE

STACKED PACKAGE STRUCTURE

PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUITS AND FABRICATION METHODS THEREOF

PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF