Chu-Chun HSIEH

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Double-patterning method to improve sidewall uniformity
- Patent number 12,106,964
- Issue date Oct 1, 2024
- Winbond Electronics Corp.
- Chu-Chun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory device
- Patent number 10,840,382
- Issue date Nov 17, 2020
- Winbond Electronics Corp.
- Chu-Chun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory device and method for manufacturing the same
- Patent number 10,720,533
- Issue date Jul 21, 2020
- Winbond Electronics Corp.
- Chu-Chun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240222191
- Publication date Jul 4, 2024
- WINBOND ELECTRONICS CORP.
- Ping-Lung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20230290642
- Publication date Sep 14, 2023
- WINBOND ELECTRONICS CORP.
- Yu-Jen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING METHOD
- Publication number 20210391174
- Publication date Dec 16, 2021
- WINBOND ELECTRONICS CORP.
- Chu-Chun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE
- Publication number 20200303557
- Publication date Sep 24, 2020
- WINBOND ELECTRONICS CORP.
- Chu-Chun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190081177
- Publication date Mar 14, 2019
- WINBOND ELECTRONICS CORP.
- Chu-Chun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS