CHU-CHUN HSU

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Miaoli County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method of the same
- Patent number 11,152,320
- Issue date Oct 19, 2021
- Inpaq Technology Co., Ltd.
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor package
- Patent number 10,468,378
- Issue date Nov 5, 2019
- Inpaq Technology Co., Ltd.
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 8,846,453
- Issue date Sep 30, 2014
- Inpaq Technology Co., Ltd.
- Chu-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREPARING A SEMICONDUCTOR PACKAGE
- Publication number 20180269180
- Publication date Sep 20, 2018
- INPAQ TECHNOLOGY CO., LTD.
- Yu-Ming PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180269123
- Publication date Sep 20, 2018
- INPAQ TECHNOLOGY CO., LTD.
- Yu-Ming PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20170012010
- Publication date Jan 12, 2017
- INPAQ TECHNOLOGY CO., LTD.
- YU-MING PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20170011961
- Publication date Jan 12, 2017
- YU-MING PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20170012011
- Publication date Jan 12, 2017
- YU-MING PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140264888
- Publication date Sep 18, 2014
- INPAQ TECHNOLOGY CO., LTD.
- CHU-CHUN HSU
- H01 - BASIC ELECTRIC ELEMENTS