Chu-Fu Lin

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitor structure and method for manufacturing the same
- Patent number 12,040,354
- Issue date Jul 16, 2024
- United Microelectronics Corp.
- Teng-Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing capacitor structure
- Patent number 12,034,038
- Issue date Jul 9, 2024
- United Microelectronics Corp.
- Teng-Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and method for manufacturing the same
- Patent number 11,646,343
- Issue date May 9, 2023
- United Microelectronics Corp.
- Teng-Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,616,035
- Issue date Mar 28, 2023
- UNITED MICROELECTRONICS CORP.
- Teng-Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,886,241
- Issue date Jan 5, 2021
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 10,818,616
- Issue date Oct 27, 2020
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via structure
- Patent number 10,504,821
- Issue date Dec 10, 2019
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 10,340,231
- Issue date Jul 2, 2019
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 10,192,808
- Issue date Jan 29, 2019
- United Microelectronics Corp.
- Teng-Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming chip with through silicon via electrode
- Patent number 9,437,491
- Issue date Sep 6, 2016
- United Microelectronics Corp.
- Ming-Tse Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level package
- Patent number 9,269,645
- Issue date Feb 23, 2016
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip with through silicon via electrode and method of forming the same
- Patent number 9,123,789
- Issue date Sep 1, 2015
- United Microelectronics Corp.
- Ming-Tse Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with integrated passive devices and method of manufacturi...
- Patent number 9,035,457
- Issue date May 19, 2015
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse structure and programming method thereof
- Patent number 8,884,398
- Issue date Nov 11, 2014
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level processing method and structure to manufacture two kind...
- Patent number 8,674,507
- Issue date Mar 18, 2014
- Megit Acquisition Corp.
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with bumps and testing pads
- Patent number 7,977,803
- Issue date Jul 12, 2011
- Megica Corporation
- Nick Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with bumps and testing pads
- Patent number 7,855,461
- Issue date Dec 21, 2010
- Megica Corporation
- Nick Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with pads having bumps or wirebonded wires formed th...
- Patent number 7,394,161
- Issue date Jul 1, 2008
- Megica Corporation
- Nick Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240429093
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240371695
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Chuan-Lan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332351
- Publication date Oct 3, 2024
- United Microelectronics Corp.
- Teng-Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DISPLAY DEVICE
- Publication number 20240315095
- Publication date Sep 19, 2024
- UNITED MICROELECTRONICS CORP.
- Chuan-Lan Lin
Information Patent Application
CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230238425
- Publication date Jul 27, 2023
- United Microelectronics Corp.
- Teng-Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR STRUCTURE
- Publication number 20230223431
- Publication date Jul 13, 2023
- United Microelectronics Corp.
- Teng-Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230025541
- Publication date Jan 26, 2023
- United Microelectronics Corp.
- Teng-Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220208958
- Publication date Jun 30, 2022
- United Microelectronics Corp.
- Teng-Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210005559
- Publication date Jan 7, 2021
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20200243386
- Publication date Jul 30, 2020
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20190221528
- Publication date Jul 18, 2019
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20190013259
- Publication date Jan 10, 2019
- UNITED MICROELECTRONICS CORP.
- Teng-Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180269167
- Publication date Sep 20, 2018
- United Microelectronics Corp.
- Chun-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA STRUCTURE
- Publication number 20170221796
- Publication date Aug 3, 2017
- UNITED MICROELECTRONICS CORP.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGE
- Publication number 20160064300
- Publication date Mar 3, 2016
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming Chip With Through Silicon Via Electrode
- Publication number 20150311117
- Publication date Oct 29, 2015
- UNITED MICROELECTRONICS CORP.
- Ming-Tse Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE STRUCTURE AND PROGRAMMING METHOD THEREOF
- Publication number 20140291801
- Publication date Oct 2, 2014
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip With Through Silicon Via Electrode And Method Of Forming The Same
- Publication number 20140203394
- Publication date Jul 24, 2014
- UNITED MICROELECTRONICS CORP.
- Ming-Tse Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH INTEGRATED PASSIVE DEVICES AND METHOD OF MANUFACTURI...
- Publication number 20140145326
- Publication date May 29, 2014
- UNITED MICROELECTRONICS CORP.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE TRIMMING METHOD
- Publication number 20140113452
- Publication date Apr 24, 2014
- United Microelectronics Corp.
- Chu-Fu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH BUMPS AND TESTING PADS
- Publication number 20110049515
- Publication date Mar 3, 2011
- MEGICA Corporation
- Nick Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DICING WAFER
- Publication number 20090137097
- Publication date May 28, 2009
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip structure with bumps and testing pads
- Publication number 20080224326
- Publication date Sep 18, 2008
- MEGICA CORPORATION
- Nick Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip structure with bumps and testing pads
- Publication number 20050121804
- Publication date Jun 9, 2005
- Nick Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Water level processing method and structure to manufacture two kind...
- Publication number 20050017355
- Publication date Jan 27, 2005
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Capacitor structure and method for manufacturing the same

Method for manufacturing capacitor structure

Capacitor structure and method for manufacturing the same

Semiconductor structure

Semiconductor package structure

Semiconductor package structure and method for forming the same

Through-silicon via structure

Semiconductor package structure and method for forming the same

Semiconductor structure

Method of forming chip with through silicon via electrode

Fan-out wafer level package

Chip with through silicon via electrode and method of forming the same

Substrate with integrated passive devices and method of manufacturi...

Anti-fuse structure and programming method thereof

Wafer level processing method and structure to manufacture two kind...

Chip structure with bumps and testing pads

Chip structure with bumps and testing pads

Chip structure with pads having bumps or wirebonded wires formed th...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

MICRO DISPLAY DEVICE

CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING CAPACITOR STRUCTURE

SEMICONDUCTOR STRUCTURE

CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

THROUGH-SILICON VIA STRUCTURE

FAN-OUT WAFER LEVEL PACKAGE

Method Of Forming Chip With Through Silicon Via Electrode

ANTI-FUSE STRUCTURE AND PROGRAMMING METHOD THEREOF

Chip With Through Silicon Via Electrode And Method Of Forming The Same

SUBSTRATE WITH INTEGRATED PASSIVE DEVICES AND METHOD OF MANUFACTURI...

WAFER EDGE TRIMMING METHOD

CHIP STRUCTURE WITH BUMPS AND TESTING PADS

METHOD FOR DICING WAFER

Chip structure with bumps and testing pads

Chip structure with bumps and testing pads

Water level processing method and structure to manufacture two kind...