Chuan-Fa Lin

Person

Shu Lin City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-wavelength white light-emitting structure
- Patent number 7,804,162
- Issue date Sep 28, 2010
- Harvatek Corporation
- Bily Wang
- F21 - LIGHTING
Information Patent Grant
Wafer level electro-optical semiconductor manufacture fabrication m...
- Patent number 7,655,997
- Issue date Feb 2, 2010
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor
- Patent number 7,276,782
- Issue date Oct 2, 2007
- Harvatek Corporation
- Billy Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...
- Publication number 20120094407
- Publication date Apr 19, 2012
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...
- Publication number 20100301349
- Publication date Dec 2, 2010
- HARVATEK CORPORATION
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-wavelength white light-emitting structure
- Publication number 20090152574
- Publication date Jun 18, 2009
- Bily Wang
- F21 - LIGHTING
Information Patent Application
Wafer level electro-optical simiconductor manufacture fabrication m...
- Publication number 20060261488
- Publication date Nov 23, 2006
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level electro-optical semiconductor manufacture fabrication m...
- Publication number 20060258031
- Publication date Nov 16, 2006
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-wavelength white light emitting diode
- Publication number 20060249739
- Publication date Nov 9, 2006
- Bily Wang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wafer level electro-optical semiconductor manufacture fabrication m...
- Publication number 20060166477
- Publication date Jul 27, 2006
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure for semiconductor
- Publication number 20050139855
- Publication date Jun 30, 2005
- Harvatek Corporation
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS

Chuan-Fa Lin

Person

Patents Grantslast 30 patents

Multi-wavelength white light-emitting structure

Wafer level electro-optical semiconductor manufacture fabrication m...

Package structure for semiconductor

Patents Applicationslast 30 patents

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFF...

Multi-wavelength white light-emitting structure

Wafer level electro-optical simiconductor manufacture fabrication m...

Wafer-level electro-optical semiconductor manufacture fabrication m...

Multi-wavelength white light emitting diode

Wafer level electro-optical semiconductor manufacture fabrication m...

Package structure for semiconductor