Chuan HU

Person

Guangzhou, Guangdong, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding method
- Patent number 12,266,623
- Issue date Apr 1, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
- Yunzhi Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filter radio frequency module packaging structure and method for ma...
- Patent number 12,184,253
- Issue date Dec 31, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang Yan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Chip interconnection package structure and method
- Patent number 12,112,956
- Issue date Oct 8, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack packaging structure and chip stack packaging method
- Patent number 11,869,872
- Issue date Jan 9, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure for filter chip
- Patent number 11,784,625
- Issue date Oct 10, 2023
- GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
- Yingqiang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging method and fan-out packaging plate
- Patent number 11,710,646
- Issue date Jul 25, 2023
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch control substrate and preparation method thereof, touch contr...
- Patent number 11,609,672
- Issue date Mar 21, 2023
- Institute of Semiconductors, Guangdong Academy of Sciences
- Zibai Li
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...
- Publication number 20250157971
- Publication date May 15, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240304556
- Publication date Sep 12, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Xun XIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20240283132
- Publication date Aug 22, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240234328
- Publication date Jul 11, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE SUITABLE FOR CHIPLET FINE LINE AND MANUFACTURING...
- Publication number 20240186254
- Publication date Jun 6, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153913
- Publication date May 9, 2024
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yinhua CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
- Publication number 20240136297
- Publication date Apr 25, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTER RADIO FREQUENCY MODULE PACKAGING STRUCTURE AND METHOD FOR MA...
- Publication number 20240007072
- Publication date Jan 4, 2024
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yingqiang YAN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CHIP FINE LINE FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20230253333
- Publication date Aug 10, 2023
- GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY
- Yingqiang YAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT TYPE PACKAGE PREPARATION METHOD OF FAN-OUT TYPE PACKAGE
- Publication number 20230245944
- Publication date Aug 3, 2023
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yingqiang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD
- Publication number 20230178514
- Publication date Jun 8, 2023
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20220375892
- Publication date Nov 24, 2022
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yinhua CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERCONNECTION PACKAGE STRUCTURE AND METHOD
- Publication number 20220254651
- Publication date Aug 11, 2022
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20220149007
- Publication date May 12, 2022
- INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
- Yuan BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-out Packaging Method and Fan-out Packaging Plate
- Publication number 20220051908
- Publication date Feb 17, 2022
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS
- Publication number 20210358883
- Publication date Nov 18, 2021
- SHENZHEN XIUYI INVESTMENT DEVELOPMENT PARTNERSHIP (LIMITED PARTNERSHIP)
- Chuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE FOR FILTER CHIP
- Publication number 20210184649
- Publication date Jun 17, 2021
- Yingqiang YAN
- H03 - BASIC ELECTRONIC CIRCUITRY

Person

Patents Grantslast 30 patents

Substrate bonding method

Filter radio frequency module packaging structure and method for ma...

Chip interconnection package structure and method

Chip stack packaging structure and chip stack packaging method

Packaging method and package structure for filter chip

Fan-out packaging method and fan-out packaging plate

Touch control substrate and preparation method thereof, touch contr...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL CHIP STACK PREPARING METHOD AND THREE-DIMENSIONAL...

CHIPLET-FINE-INTERCONNECTION-PACKAGE STRUCTURE AND METHOD OF MANUFA...

FAN-OUT PACKAGE STRUCTURE AND FABRICATION METHOD THEREFOR

MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...

CARRIER STRUCTURE SUITABLE FOR CHIPLET FINE LINE AND MANUFACTURING...

3D STACKED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...

SUBSTRATE BONDING METHOD

FILTER RADIO FREQUENCY MODULE PACKAGING STRUCTURE AND METHOD FOR MA...

CHIP FINE LINE FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD T...

FAN-OUT TYPE PACKAGE PREPARATION METHOD OF FAN-OUT TYPE PACKAGE

CHIP STACK PACKAGING STRUCTURE AND CHIP STACK PACKAGING METHOD

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

CHIP INTERCONNECTION PACKAGE STRUCTURE AND METHOD

CHIP PACKAGING STRUCTURE AND METHOD

Fan-out Packaging Method and Fan-out Packaging Plate

FAN-OUT PACKAGING METHOD EMPLOYING COMBINED PROCESS

PACKAGING METHOD AND PACKAGE STRUCTURE FOR FILTER CHIP