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Hsinchu City, TW
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor structure and the forming method thereof
Patent number
11,839,075
Issue date
Dec 5, 2023
Winbond Electronics Corp.
Chih-Jung Ni
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor structure and the forming method thereof
Patent number
11,302,705
Issue date
Apr 12, 2022
Winbond Electronics Corp.
Chih-Jung Ni
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR STRUCTURE AND THE FORMING METHOD THEREOF
Publication number
20220189975
Publication date
Jun 16, 2022
WINBOND ELECTRONICS CORP.
Chih-Jung NI
G11 - INFORMATION STORAGE
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND THE FORMING METHOD THEREOF
Publication number
20200152647
Publication date
May 14, 2020
WINBOND ELECTRONICS CORP.
Chih-Jung NI
G11 - INFORMATION STORAGE
Information
Patent Application
WAFER POD GAS CHARGING APPARATUS
Publication number
20140041755
Publication date
Feb 13, 2014
SANTA PHOENIX TECHNOLOGY INC.
CHUAN-HUA CHOU
H01 - BASIC ELECTRIC ELEMENTS