Chuan-Jane Chao

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method and test structures for measuring interconnect coupling capa...
- Patent number 6,870,387
- Issue date Mar 22, 2005
- Winbond Electronics Corporation
- Kai-Ye Huang
- G01 - MEASURING TESTING
Information Patent Grant
Testing method for buried strap and deep trench leakage current
- Patent number 6,377,067
- Issue date Apr 23, 2002
- Winbond Electronics Corporation
- Shih-Hsien Yang
- G01 - MEASURING TESTING
Information Patent Grant
Method for extracting substrate coupling coefficient of a flash memory
- Patent number 6,292,393
- Issue date Sep 18, 2001
- Winbond Electronics Corp.
- Jung-Yu Tsai
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Method and test structures for measuring interconnect coupling capa...
- Publication number 20050024077
- Publication date Feb 3, 2005
- Winbond Electronics Corporation
- Kai-Ye Huang
- G01 - MEASURING TESTING
Information Patent Application
Testing method for buried strap and deep trench leakage current
- Publication number 20020118035
- Publication date Aug 29, 2002
- Winbond Electronics Corporation (Taiwan)
- Shih-Hsien Yang
- G01 - MEASURING TESTING