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Chuan-Jin Shiu
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Zhongli City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
9,613,904
Issue date
Apr 4, 2017
Xintec Inc.
Yu-Tung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating wafer-level chip package
Patent number
9,230,927
Issue date
Jan 5, 2016
Xintec Inc.
Chuan-Jin Shiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method for forming the same
Patent number
8,900,913
Issue date
Dec 2, 2014
Chuan-Jin Shiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method for forming the same
Patent number
8,890,191
Issue date
Nov 18, 2014
Chuan-Jin Shiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor stacked package and method of fabricating the same
Patent number
8,836,134
Issue date
Sep 16, 2014
Xintec Inc.
Po-Shen Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Chip package having optical-electronic device with plurality of lig...
Patent number
8,785,956
Issue date
Jul 22, 2014
Chuan-Jin Shiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
8,779,452
Issue date
Jul 15, 2014
Tzu-Hsiang Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure for a chip and method for fabricating the same
Patent number
8,633,558
Issue date
Jan 21, 2014
Ta-Hsuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
8,604,578
Issue date
Dec 10, 2013
Hsin-Chih Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method for fabricating the same
Patent number
8,575,634
Issue date
Nov 5, 2013
Tsang-Yu Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package
Patent number
8,536,671
Issue date
Sep 17, 2013
Tsang-Yu Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and method for forming the same
Patent number
8,431,946
Issue date
Apr 30, 2013
Hsin-Chih Chiu
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Chip package
Patent number
8,384,174
Issue date
Feb 26, 2013
Hsin-Chih Chiu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20160329283
Publication date
Nov 10, 2016
XINTEC INC.
Yu-Tung CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER COATING SYSTEM AND METHOD OF MANUFACTURING CHIP PACKAGE
Publication number
20160307779
Publication date
Oct 20, 2016
XINTEC INC.
Yu-Tung CHEN
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
METHOD OF FABRICATING WAFER-LEVEL CHIP PACKAGE
Publication number
20150099357
Publication date
Apr 9, 2015
XINTEC INC.
Chuan-Jin SHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STACKED PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20130187263
Publication date
Jul 25, 2013
Xintec Inc.
Po-Shen Lin
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20130045549
Publication date
Feb 21, 2013
Chuan-Jin SHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20130026523
Publication date
Jan 31, 2013
Chuan-Jin SHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20130001621
Publication date
Jan 3, 2013
Chuan-Jin SHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20120097999
Publication date
Apr 26, 2012
Hsin-Chih CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20120056226
Publication date
Mar 8, 2012
Tzu-Hsiang HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20110298000
Publication date
Dec 8, 2011
Tsang-Yu LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20110291139
Publication date
Dec 1, 2011
Hsin-Chih CHIU
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
CHIP PACKAGE
Publication number
20110233770
Publication date
Sep 29, 2011
Hsin-Chih CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE FOR A CHIP AND METHOD FOR FABRICATING THE SAME
Publication number
20110156191
Publication date
Jun 30, 2011
Ta-Hsuan LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20110156074
Publication date
Jun 30, 2011
Tsang-Yu LIU
H01 - BASIC ELECTRIC ELEMENTS