Chuan-Ming Yeh

Person

Miao-Li County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of package structure of electronic device
- Patent number 12,191,197
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ching-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure and manufacturing method thereof
- Patent number 12,107,036
- Issue date Oct 1, 2024
- INNOLUX CORPORATION
- Kuo-Jung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite layer circuit element and manufacturing method thereof
- Patent number 11,764,077
- Issue date Sep 19, 2023
- INNOLUX CORPORATION
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240421060
- Publication date Dec 19, 2024
- Innolux Corporation
- Kuo-Jung Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE WITH REDUCED SUBSTRATE WA...
- Publication number 20230402292
- Publication date Dec 14, 2023
- InnoLux Corporation
- Chuan-Ming YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE LAYER CIRCUIT ELEMENT
- Publication number 20230377904
- Publication date Nov 23, 2023
- InnoLux Corporation
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE
- Publication number 20230238278
- Publication date Jul 27, 2023
- InnoLux Corporation
- Ching-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE
- Publication number 20230038309
- Publication date Feb 9, 2023
- InnoLux Corporation
- Yi-Hung LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE LAYER CIRCUIT ELEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20230026151
- Publication date Jan 26, 2023
- InnoLux Corporation
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220181242
- Publication date Jun 9, 2022
- InnoLux Corporation
- Kuo-Jung Fan
- H01 - BASIC ELECTRIC ELEMENTS

Chuan-Ming Yeh

Person

Patents Grantslast 30 patents

Manufacturing method of package structure of electronic device

Redistribution layer structure and manufacturing method thereof

Composite layer circuit element and manufacturing method thereof

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

METHOD OF MANUFACTURING ELECTRONIC DEVICE WITH REDUCED SUBSTRATE WA...

COMPOSITE LAYER CIRCUIT ELEMENT

MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE

PACKAGE DEVICE

COMPOSITE LAYER CIRCUIT ELEMENT AND MANUFACTURING METHOD THEREOF

REDISTRIBUTION LAYER STRUCTURE AND MANUFACTURING METHOD THEREOF