Chuansheng LIU

Follow

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation using airflow diversion with cooling fins
- Patent number 11,106,256
- Issue date Aug 31, 2021
- Intel Corporation
- Tao Shu
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE
- Publication number 20240179832
- Publication date May 30, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTORS FOR PROCESSING PACKAGES
- Publication number 20240136766
- Publication date Apr 25, 2024
- Siva Prasad Jangili Ganga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESILIENT ELECTRICAL CONNECTORS FOR ELECTROMAGNETIC INTERFERENCE SH...
- Publication number 20220139843
- Publication date May 5, 2022
- Intel Corporation
- Jun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASCADED CONNECTION TECHNOLOGY FOR VEHICLE PLATOONS
- Publication number 20220105954
- Publication date Apr 7, 2022
- Intel Corporation
- Fei Li
- B60 - VEHICLES IN GENERAL
Information Patent Application
HEAT DISSIPATION USING AIRFLOW DIVERSION WITH COOLING FINS
- Publication number 20200218317
- Publication date Jul 9, 2020
- Intel Corporation
- Tao SHU
- F28 - HEAT EXCHANGE IN GENERAL