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Patents Grantslast 30 patents

Information Patent Grant
Bonding member, method for producing bonding member and method for...
- Patent number 12,134,146
- Issue date Nov 5, 2024
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure production method and bonding structure
- Patent number 12,094,850
- Issue date Sep 17, 2024
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINTERED MATERIAL, METAL SINTERED COMPACT, METHOD FOR PRODUCING SIN...
- Publication number 20240278321
- Publication date Aug 22, 2024
- TOPPAN Holdings Inc.
- Takuya SEKIGUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR...
- Publication number 20220347799
- Publication date Nov 3, 2022
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE PRODUCTION METHOD AND BONDING STRUCTURE
- Publication number 20220230988
- Publication date Jul 21, 2022
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MEMBER, METHOD FOR PRODUCING BONDING MEMBER AND METHOD FOR...
- Publication number 20200039007
- Publication date Feb 6, 2020
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR