Chuck Anderson

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Organic packages having low tin solder connections
- Patent number 6,812,570
- Issue date Nov 2, 2004
- Advanced Micro Devices, Inc.
- Raj N. Master
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for reconfiguring circuit board and integrated...
- Patent number 6,732,266
- Issue date May 4, 2004
- Advanced Micro Devices, Inc.
- Charles Anderson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal carrier tray
- Patent number 6,474,476
- Issue date Nov 5, 2002
- Advanced Micro Devices, Inc.
- Charles Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package incorporating camouflaged programmable e...
- Patent number 6,449,170
- Issue date Sep 10, 2002
- Advanced Micro Devices, Inc.
- Quang D. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for encapsulated dice employing EMR-sensitive adhesives
- Patent number 6,412,641
- Issue date Jul 2, 2002
- Advanced Micro Devices, Inc.
- Charles Anderson
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Lead cut and tape attach apparatus
- Patent number 5,108,536
- Issue date Apr 28, 1992
- Advanced Micro Devices, Inc.
- Paul J. Sokolovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for mounting a heat sink
- Patent number 4,804,172
- Issue date Feb 14, 1989
- Advanced Micro Devices, Inc.
- Paul J. Sokolovsky
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Organic packages having low tin solder connections
- Publication number 20030037959
- Publication date Feb 27, 2003
- Raj N. Master
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC PACKAGES WITH SOLDERS FOR RELIABLE FLIP CHIP CONNECTIONS
- Publication number 20020170746
- Publication date Nov 21, 2002
- RAJ N MASTER
- H01 - BASIC ELECTRIC ELEMENTS

Chuck Anderson

Person

Patents Grantslast 30 patents

Organic packages having low tin solder connections

Method and apparatus for reconfiguring circuit board and integrated...

Universal carrier tray

Integrated circuit package incorporating camouflaged programmable e...

Packaging for encapsulated dice employing EMR-sensitive adhesives

Lead cut and tape attach apparatus

Fixture for mounting a heat sink

Patents Applicationslast 30 patents

Organic packages having low tin solder connections

ORGANIC PACKAGES WITH SOLDERS FOR RELIABLE FLIP CHIP CONNECTIONS