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Chueh-An Hsieh
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Kaohsiung, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Substrate process for an embedded component
Patent number
7,727,818
Issue date
Jun 1, 2010
Advanced Semiconductor Engineering, Inc.
Chueh-An Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bumping process and structure thereof
Patent number
7,651,937
Issue date
Jan 26, 2010
Advanced Semiconductor Engineering, Inc.
Chueh-An Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming bumps
Patent number
7,541,273
Issue date
Jun 2, 2009
Advanced Semiconductor Engineering, Inc.
Chueh-An Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer structure with a multi-layer barrier in an UBM layer network...
Patent number
7,518,241
Issue date
Apr 14, 2009
Advanced Semiconductor Engineering Inc.
Li-Cheng Tai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20100314746
Publication date
Dec 16, 2010
Chueh-An Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate process for an embedded component
Publication number
20080220566
Publication date
Sep 11, 2008
Chueh-An Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Flip chip package and manufacturing method of the same
Publication number
20070120269
Publication date
May 31, 2007
Advanced Semiconductor Engineering, Inc.
Chueh-An Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip structure and manufacturing method of the same
Publication number
20070108612
Publication date
May 17, 2007
Advanced Semiconductor Engineering, Inc.
Chueh-An Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING BUMPS
Publication number
20070087548
Publication date
Apr 19, 2007
Chueh-An Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bumping process and structure thereof
Publication number
20070049001
Publication date
Mar 1, 2007
Advanced Semiconductor Engineering, Inc.
Chueh-An Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer structure
Publication number
20070045848
Publication date
Mar 1, 2007
Advanced Semiconductor Engineering, Inc.
Li-Cheng Tai
H01 - BASIC ELECTRIC ELEMENTS