Chuei-Tang Wang

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,191,270
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,174,415
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- G02 - OPTICS
Information Patent Grant
Interposer directly bonded to bonding pads on a plurality of dies
- Patent number 12,165,952
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus including antennas and directors
- Patent number 12,136,593
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack structure and manufacturing method thereof
- Patent number 12,125,824
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,125,812
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,125,798
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,100,698
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,094,860
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,087,757
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacks and methods forming same
- Patent number 12,080,684
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep partition power delivery with deep trench capacitor
- Patent number 12,068,295
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,057,407
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 12,051,649
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 12,046,480
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shou Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device
- Patent number 12,040,566
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising rigid-flexible substrate...
- Patent number 12,040,281
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising thermally conductive layer around the...
- Patent number 12,033,963
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding low-k materials in antennas
- Patent number 11,984,668
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,948,926
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 11,929,333
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,923,315
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,908,787
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,854,928
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory packages and methods of forming same
- Patent number 11,855,046
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, device and methods of manufacture
- Patent number 11,848,235
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly and manufacturing method thereof
- Patent number 11,841,541
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,830,841
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method
- Patent number 11,830,864
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON-BASED PHOTONIC QUANTUM MEMORY DEVICES AND METHODS FOR FORMI...
- Publication number 20240402423
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chung-Hao Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240404900
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240393653
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH OPTICAL ELEMENTS AND METHOD FOR MANUFACTURIN...
- Publication number 20240387329
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387489
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chia LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240387493
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS
- Publication number 20240387367
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Chun Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION
- Publication number 20240387502
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20240379382
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHOU ZEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240379601
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240379619
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...
- Publication number 20240379738
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STACK STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371828
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20240371842
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240371851
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKS AND METHODS FORMING SAME
- Publication number 20240363590
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTON SOURCE AND OPTICAL COMPUTING ARCHITECTURE
- Publication number 20240361521
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin Lu
- G02 - OPTICS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR F...
- Publication number 20240363547
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240355755
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR
- Publication number 20240355799
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH SUBSTRATES AND METHOD FOR FORMING THE SAME
- Publication number 20240355771
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE
- Publication number 20240355746
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20240332807
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321786
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...
- Publication number 20240321757
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258287
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240258286
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20240241316
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE
- Publication number 20240213186
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Chuei-Tang Wang

Person

Patents Grantslast 30 patents

Integrated circuit package and method of forming same

Semiconductor package and manufacturing method thereof

Interposer directly bonded to bonding pads on a plurality of dies

Electronic apparatus including antennas and directors

Semiconductor stack structure and manufacturing method thereof

Integrated circuit packages and methods of forming the same

Semiconductor package and method

Semiconductor device and manufacturing method thereof

Package structure and manufacturing method thereof

Integrated circuit packages

Die stacks and methods forming same

Deep partition power delivery with deep trench capacitor

Semiconductor package and method

Architecture for computing system package

Manufacturing method of a semiconductor device

Antenna device

Semiconductor package structure comprising rigid-flexible substrate...

Package structure comprising thermally conductive layer around the...

Semiconductor packages having a die, an encapsulant, and a redistri...

Method of embedding low-k materials in antennas

Integrated circuit package and method

Integrated fan-out package

Semiconductor package and manufacturing method thereof

Package structure and method of manufacturing the same

Semiconductor package and manufacturing method thereof

Memory packages and methods of forming same

System, device and methods of manufacture

Package assembly and manufacturing method thereof

Semiconductor package and method for manufacturing the same

Photonic semiconductor device and method

Patents Applicationslast 30 patents

SILICON-BASED PHOTONIC QUANTUM MEMORY DEVICES AND METHODS FOR FORMI...

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGE STRUCTURE WITH OPTICAL ELEMENTS AND METHOD FOR MANUFACTURIN...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD OF FORMING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING ELECTRONIC APPARATUS

METHOD AND STRUCTURE FOR 3DIC POWER DISTRIBUTION

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGES

STRUCTURE AND FORMATION METHOD OF INTEGRATED CHIPS PACKAGE WITH CAP...

SEMICONDUCTOR STACK STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE STRUCTURE

INTEGRATED CIRCUIT PACKAGES

DIE STACKS AND METHODS FORMING SAME

PHOTON SOURCE AND OPTICAL COMPUTING ARCHITECTURE

CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR F...

Semiconductor Package and Method

DEEP PARTITION POWER DELIVERY WITH DEEP TRENCH CAPACITOR

CHIP PACKAGE STRUCTURE WITH SUBSTRATES AND METHOD FOR FORMING THE SAME

ARCHITECTURE FOR COMPUTING SYSTEM PACKAGE

ANTENNA DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING RIGID-FLEXIBLE SUBSTRATE...

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGE AND METHOD

Semiconductor Device and Methods of Manufacture

INTEGRATED FAN-OUT PACKAGE