Chuen Khiang WANG

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,881,863
- Issue date Jan 30, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,589,875
- Issue date Mar 7, 2017
- UTAC HEADQUARTERS PTE. LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,391,026
- Issue date Jul 12, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Chuen Khiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,136,142
- Issue date Sep 15, 2015
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,916,422
- Issue date Dec 23, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,860,079
- Issue date Oct 14, 2014
- United Test & Assembly Center Ltd.
- Catherine Bee Liang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,829,666
- Issue date Sep 9, 2014
- United Test & Assembly Center Ltd.
- Catherine Bee Liang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 8,716,873
- Issue date May 6, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die IC package and manufacturing method
- Patent number 7,816,775
- Issue date Oct 19, 2010
- United Test & Assembly Center Limited
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die packages
- Patent number 7,723,833
- Issue date May 25, 2010
- United Test & Assembly Center Ltd.
- Gaurav Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method of manufacture
- Patent number 7,678,610
- Issue date Mar 16, 2010
- UTAC - United Test and Assembly Test Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20170148722
- Publication date May 25, 2017
- UTAC Headquarters Pte. Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150380346
- Publication date Dec 31, 2015
- UTAC Headquarters Pte. Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150084197
- Publication date Mar 26, 2015
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140264835
- Publication date Sep 18, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140227832
- Publication date Aug 14, 2014
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120220082
- Publication date Aug 30, 2012
- United Test and Assembly Center, Ltd.
- Catherine Bee Liang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120119378
- Publication date May 17, 2012
- United Test & Assembly Center Ltd.
- Catherine Bee Liang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20120001306
- Publication date Jan 5, 2012
- United Test & Assembly Center Ltd.
- Chuen Khiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Scale Package and Method of Assembling the Same
- Publication number 20080290509
- Publication date Nov 27, 2008
- UNITED TEST AND ASSEMBLY CENTER
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20080251938
- Publication date Oct 16, 2008
- UTAC - United Test and Assembly Center LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Ic Package and Manufacturing Method
- Publication number 20080150103
- Publication date Jun 26, 2008
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die Packages
- Publication number 20080054435
- Publication date Mar 6, 2008
- United Test and Assembly Center, Ltd.
- Gaurav MEHTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple stacked die window csp package and method of manufacture
- Publication number 20070132081
- Publication date Jun 14, 2007
- United Test & Assembly Center Limited
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and method of manufacture
- Publication number 20060192292
- Publication date Aug 31, 2006
- UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Chuen Khiang WANG

Person

Patents Grantslast 30 patents

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Multi-die IC package and manufacturing method

Stacked die packages

Semiconductor chip package and method of manufacture

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

Chip Scale Package and Method of Assembling the Same

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE

Multi-Die Ic Package and Manufacturing Method

Stacked Die Packages

Multiple stacked die window csp package and method of manufacture

Semiconductor chip package and method of manufacture