TREA

Chueng-Jen Wang

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  • Hsin-Chu, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor storage apparatus with integrated sorter
    • Patent number 12,198,956
    • Issue date Jan 14, 2025
    • Taiwan Semiconductor Manufacturing Company Limited
    • Tsung-Sheng Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Systems and methods for die transfer
    • Patent number 11,459,190
    • Issue date Oct 4, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tsung-Sheng Kuo
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Systems and methods for die transfer
    • Patent number 10,822,181
    • Issue date Nov 3, 2020
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Tsung-Sheng Kuo
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR STORAGE APPARATUS WITH INTEGRATED SORTER
    • Publication number 20250149360
    • Publication date May 8, 2025
    • Taiwan Semiconductor Manufacturing Company Limited
    • Tsung-Sheng KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEMS AND METHODS FOR DIE TRANSFER
    • Publication number 20220384222
    • Publication date Dec 1, 2022
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Tsung-Sheng KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STORAGE APPARATUS WITH INTEGRATED SORTER
    • Publication number 20220037178
    • Publication date Feb 3, 2022
    • Taiwan Semiconductor Manufacturing Company Limited
    • Tsung-Sheng KUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SYSTEMS AND METHODS FOR DIE TRANSFER
    • Publication number 20210078809
    • Publication date Mar 18, 2021
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Tsung-Sheng Kuo
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    SYSTEMS AND METHODS FOR DIE TRANSFER
    • Publication number 20200156884
    • Publication date May 21, 2020
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Tsung-Sheng Kuo
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL