Chulmin Kim

Person

Chungcheongnam-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus
- Patent number 9,698,117
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Yongdae Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magazine for loading a lead frame
- Patent number 8,905,239
- Issue date Dec 9, 2014
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR OVERLOAD CONTROL
- Publication number 20240276205
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Junhyuk SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR E2 SETUP PROCEDURE
- Publication number 20240237003
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Junhyuk SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS AND METHOD FOR PROVIDING SPECIFICATION VERSION
- Publication number 20240064825
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Junhyuk SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS AND METHOD FOR PROVIDING SPECIFICATION VERSION
- Publication number 20240064826
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Junhyuk SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS AND METHOD FOR E2 NODE CONTROL AND CELL CONTROL IN WIRELE...
- Publication number 20230139546
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Junhyuk SONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20150228612
- Publication date Aug 13, 2015
- Samsung Electronics Co., Ltd.
- Yongdae HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EJECTOR AND DIE SEPARATION METHOD
- Publication number 20140238618
- Publication date Aug 28, 2014
- Samsung Electronics Co., Ltd.
- Yisung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGAZINE FOR LOADING A LEAD FRAME
- Publication number 20130256186
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Chulmin Kim

Person

Patents Grantslast 30 patents

Die bonding apparatus

Magazine for loading a lead frame

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND METHOD FOR OVERLOAD CONTROL

ELECTRONIC DEVICE AND METHOD FOR E2 SETUP PROCEDURE

APPARATUS AND METHOD FOR PROVIDING SPECIFICATION VERSION

APPARATUS AND METHOD FOR PROVIDING SPECIFICATION VERSION

APPARATUS AND METHOD FOR E2 NODE CONTROL AND CELL CONTROL IN WIRELE...

DIE BONDING APPARATUS

DIE EJECTOR AND DIE SEPARATION METHOD

MAGAZINE FOR LOADING A LEAD FRAME