Chulyong Jang

Person

Anyang-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnection structure of a semiconductor chip having pads of di...
- Patent number 12,315,818
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 12,224,258
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 12,021,055
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package including the same
- Patent number 11,923,286
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Wonjung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 11,824,023
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,810,837
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip and semiconductor...
- Patent number 11,626,370
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250149476
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240038699
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Wonkyun KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240030104
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MAN...
- Publication number 20230253336
- Publication date Aug 10, 2023
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20220384378
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220223551
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Wonkyun KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220199511
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- Wonjung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220102245
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND SEMICONDUCTOR...
- Publication number 20220093521
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS

Chulyong Jang

Person

Patents Grantslast 30 patents

Interconnection structure of a semiconductor chip having pads of di...

Semiconductor chip and semiconductor package including the same

Semiconductor package and method for manufacturing semiconductor pa...

Package substrate and semiconductor package including the same

Semiconductor chip and semiconductor package including the same

Semiconductor packages

Interconnection structure of a semiconductor chip and semiconductor...

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGES

INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND METHOD OF MAN...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGES

INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR CHIP AND SEMICONDUCTOR...