Chun-chi Ke

Person

Taichung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating carrier-free semiconductor package
- Patent number 11,289,409
- Issue date Mar 29, 2022
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an encapsulated electronic package using a s...
- Patent number 11,195,812
- Issue date Dec 7, 2021
- Siliconware Precision Industries Co., Ltd.
- Hsin-Yi Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,833,394
- Issue date Nov 10, 2020
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-free semiconductor package and fabrication method
- Patent number 10,566,271
- Issue date Feb 18, 2020
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 10,192,834
- Issue date Jan 29, 2019
- Siliconware Precision Industries Co., Ltd.
- Fu-Tang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including cutting encap...
- Patent number 10,074,613
- Issue date Sep 11, 2018
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having metal layer
- Patent number 9,673,151
- Issue date Jun 6, 2017
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating EMI shielding package structure
- Patent number 9,425,152
- Issue date Aug 23, 2016
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having MEMS element
- Patent number 9,254,994
- Issue date Feb 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating quad flat non-leaded package structure with...
- Patent number 9,190,387
- Issue date Nov 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package without chip carrier
- Patent number 9,190,296
- Issue date Nov 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package having electrical conne...
- Patent number 9,177,837
- Issue date Nov 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package with electronic component received in encapsulan...
- Patent number 9,040,361
- Issue date May 26, 2015
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 8,981,575
- Issue date Mar 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package without chip carrier and fabrication method t...
- Patent number 8,975,734
- Issue date Mar 10, 2015
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding package structure and method for fabricating the same
- Patent number 8,963,298
- Issue date Feb 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 8,873,244
- Issue date Oct 28, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having MEMS element
- Patent number 8,866,236
- Issue date Oct 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Quad flat non-leaded package structure with electromagnetic interfe...
- Patent number 8,736,030
- Issue date May 27, 2014
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having electrical connecting structures and f...
- Patent number 8,716,861
- Issue date May 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of package structure having MEMS element
- Patent number 8,716,070
- Issue date May 6, 2014
- Siliconware Precision Industries Co. Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package having MEMS element and fabrication method thereof
- Patent number 8,653,661
- Issue date Feb 18, 2014
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure having micro-electromechanical element
- Patent number 8,564,115
- Issue date Oct 22, 2013
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip scale package and fabrication method thereof
- Patent number 8,525,348
- Issue date Sep 3, 2013
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure
- Patent number 8,421,199
- Issue date Apr 16, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of package structure having MEMS element
- Patent number 8,420,430
- Issue date Apr 16, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package having electrical connecting structures and f...
- Patent number 8,390,118
- Issue date Mar 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package structure
- Patent number 8,304,268
- Issue date Nov 6, 2012
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of semiconductor device having conductive bumps
- Patent number 8,253,248
- Issue date Aug 28, 2012
- Siliconware Precision Industries Co., Ltd.
- Chun-Chi Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having micro-electromechanical element and fabric...
- Patent number 8,198,689
- Issue date Jun 12, 2012
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20210175196
- Publication date Jun 10, 2021
- Siliconware Precision Industries Co., Ltd.
- Hsin-Yi Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200235462
- Publication date Jul 23, 2020
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE
- Publication number 20200144167
- Publication date May 7, 2020
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20170338186
- Publication date Nov 23, 2017
- Siliconware Precision Industries Co., Ltd.
- Fu-Tang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE HAVING METAL LAYER
- Publication number 20170236787
- Publication date Aug 17, 2017
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD
- Publication number 20170200671
- Publication date Jul 13, 2017
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20170148761
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHOD
- Publication number 20160093576
- Publication date Mar 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING EMI SHIELDING PACKAGE STRUCTURE
- Publication number 20150155240
- Publication date Jun 4, 2015
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20150102433
- Publication date Apr 16, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035164
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035163
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER
- Publication number 20140315351
- Publication date Oct 23, 2014
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH...
- Publication number 20140227830
- Publication date Aug 14, 2014
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNE...
- Publication number 20140206146
- Publication date Jul 24, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140191376
- Publication date Jul 10, 2014
- Siliconware Precision Industries Co., Ltd.
- Fu-Tang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140183755
- Publication date Jul 3, 2014
- Siliconware Precision Industries Co., Ltd.
- Fu-Tang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20130203200
- Publication date Aug 8, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20130200508
- Publication date Aug 8, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...
- Publication number 20130161802
- Publication date Jun 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
- Publication number 20120286425
- Publication date Nov 15, 2012
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT
- Publication number 20120241937
- Publication date Sep 27, 2012
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20120061825
- Publication date Mar 15, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120038044
- Publication date Feb 16, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120032347
- Publication date Feb 9, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120013006
- Publication date Jan 19, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD T...
- Publication number 20120007234
- Publication date Jan 12, 2012
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SIZED PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120001328
- Publication date Jan 5, 2012
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD
- Publication number 20110298126
- Publication date Dec 8, 2011
- Siliconware Precision Industries Co., Ltd.
- Yueh-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFE...
- Publication number 20110198737
- Publication date Aug 18, 2011
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS

Chun-chi Ke

Person

Patents Grantslast 30 patents

Method for fabricating carrier-free semiconductor package

Method for fabricating an encapsulated electronic package using a s...

Electronic package and method for fabricating the same

Carrier-free semiconductor package and fabrication method

Semiconductor package and fabrication method thereof

Method of fabricating semiconductor package including cutting encap...

Semiconductor package having metal layer

Method for fabricating EMI shielding package structure

Package structure having MEMS element

Method for fabricating quad flat non-leaded package structure with...

Fabrication method of semiconductor package without chip carrier

Fabrication method of semiconductor package having electrical conne...

Chip scale package with electronic component received in encapsulan...

Semiconductor package structure

Semiconductor package without chip carrier and fabrication method t...

EMI shielding package structure and method for fabricating the same

Package structure

Package structure having MEMS element

Quad flat non-leaded package structure with electromagnetic interfe...

Semiconductor package having electrical connecting structures and f...

Fabrication method of package structure having MEMS element

Package having MEMS element and fabrication method thereof

Package structure having micro-electromechanical element

Chip scale package and fabrication method thereof

Semiconductor package structure

Fabrication method of package structure having MEMS element

Semiconductor package having electrical connecting structures and f...

Fabrication method of semiconductor package structure

Fabrication method of semiconductor device having conductive bumps

Package structure having micro-electromechanical element and fabric...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING CARRIER-FREE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE HAVING METAL LAYER

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND RELATED METHOD

METHOD FOR FABRICATING EMI SHIELDING PACKAGE STRUCTURE

PACKAGE STRUCTURE HAVING MEMS ELEMENT

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER

METHOD FOR FABRICATING QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNE...

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...

PACKAGE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE HAVING MICRO-ELECTROMECHANICAL ELEMENT

CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME

CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF

CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF

CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE WITHOUT CHIP CARRIER AND FABRICATION METHOD T...

CHIP-SIZED PACKAGE AND FABRICATION METHOD THEREOF

CARRIER-FREE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD

QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFE...