CHUN-FA LAN

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,176,299
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping structure along image sensor element to mitigate damage to...
- Patent number 12,132,066
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Kai Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping structure along image sensor element to mitigate damage to...
- Patent number 11,610,927
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Kai Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,587,887
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 11,031,376
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization apparatus and planarization method thereof
- Patent number 10,879,077
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Tung Wu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,879,192
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus of chemical mechanical polishing and operating method the...
- Patent number 10,857,651
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Kai Lan
- B24 - GRINDING POLISHING
Information Patent Grant
Vibration assistant polishing module
- Patent number 9,649,740
- Issue date May 16, 2017
- Industrial Technology Research Institute
- Chia-Jen Ting
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing bonded wafer with ultra-thin single crysta...
- Patent number 7,329,364
- Issue date Feb 12, 2008
- Industrial Technology Research Institute
- Shih-Shian Ho
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054900
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING STRUCTURE ALONG IMAGE SENSOR ELEMENT TO MITIGATE DAMAGE TO...
- Publication number 20240371907
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION
- Publication number 20240332026
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Fan CHEN
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS
- Publication number 20230395643
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Po-Chun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187383
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230067664
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING STRUCTURE ALONG IMAGE SENSOR ELEMENT TO MITIGATE DAMAGE TO...
- Publication number 20220359604
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Kai Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220223542
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS
- Publication number 20210375669
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING STRUCTURE ALONG IMAGE SENSOR ELEMENT TO MITIGATE DAMAGE TO...
- Publication number 20210273003
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Kai Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210020581
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20210020607
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsaing-Pin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS OF CHEMICAL MECHANICAL POLISHING AND OPERATING METHOD THE...
- Publication number 20190152020
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-KAI LAN
- B24 - GRINDING POLISHING
Information Patent Application
PLANARIZATION APPARATUS AND PLANARIZATION METHOD THEREOF
- Publication number 20190131148
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-TUNG WU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
VIBRATION ASSISTANT POLISHING MODULE
- Publication number 20170120415
- Publication date May 4, 2017
- Industrial Technology Research Institute
- CHIA-JEN TING
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing bonded wafer with ultra-thin single crysta...
- Publication number 20060090691
- Publication date May 4, 2006
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Shih-Shian Ho
- C30 - CRYSTAL GROWTH

CHUN-FA LAN

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Capping structure along image sensor element to mitigate damage to...

Capping structure along image sensor element to mitigate damage to...

Semiconductor device and manufacturing method thereof

Chip package and method of forming the same

Planarization apparatus and planarization method thereof

Semiconductor structure and manufacturing method thereof

Apparatus of chemical mechanical polishing and operating method the...

Vibration assistant polishing module

Method for manufacturing bonded wafer with ultra-thin single crysta...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CAPPING STRUCTURE ALONG IMAGE SENSOR ELEMENT TO MITIGATE DAMAGE TO...

SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION

SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CAPPING STRUCTURE ALONG IMAGE SENSOR ELEMENT TO MITIGATE DAMAGE TO...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SURFACE UNIFORMITY CONTROL IN PIXEL STRUCTURES OF IMAGE SENSORS

CAPPING STRUCTURE ALONG IMAGE SENSOR ELEMENT TO MITIGATE DAMAGE TO...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD OF FORMING THE SAME

APPARATUS OF CHEMICAL MECHANICAL POLISHING AND OPERATING METHOD THE...

PLANARIZATION APPARATUS AND PLANARIZATION METHOD THEREOF

VIBRATION ASSISTANT POLISHING MODULE

Method for manufacturing bonded wafer with ultra-thin single crysta...