CHUN-FU WANG

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Hsinchu County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Wafer support and thin-film deposition apparatus using the same
- Patent number 11,598,006
- Issue date Mar 7, 2023
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WAFER SUPPORT AND THIN-FILM DEPOSITION APPARATUS USING THE SAME
- Publication number 20220220615
- Publication date Jul 14, 2022
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER HOLDER FOR GENERATING STABLE BIAS VOLTAGE AND THIN FILM DEPOS...
- Publication number 20220181195
- Publication date Jun 9, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...