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Chun-Han TSAO

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  • New Taipei City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20210343849
    • Publication date Nov 4, 2021
    • Taiwan Semiconductor Manufacturing company Ltd.
    • Chun-Han TSAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer Processing Method and Apparatus
    • Publication number 20200105548
    • Publication date Apr 2, 2020
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hui Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3DIC Interconnect Apparatus and Method
    • Publication number 20190363126
    • Publication date Nov 28, 2019
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shih Pei Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20190259848
    • Publication date Aug 22, 2019
    • Taiwan Semiconductor Manufacturing company Ltd.
    • Chun-Han TSAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR MANUFACTURING MULTI-VOLTAGE DEVICES USING HIGH-K-METAL-G...
    • Publication number 20190139837
    • Publication date May 9, 2019
    • Taiwan Semiconductor Manufacturing Co., LTD
    • Chun-Han Tsao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3DIC Interconnect Apparatus and Method
    • Publication number 20180226449
    • Publication date Aug 9, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shih Pei Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer Processing Method and Apparatus
    • Publication number 20180090348
    • Publication date Mar 29, 2018
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hui Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20170365514
    • Publication date Dec 21, 2017
    • Taiwan Semiconductor Manufacturing company Ltd.
    • Chun-Han TSAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3DIC Interconnect Apparatus and Method
    • Publication number 20160204154
    • Publication date Jul 14, 2016
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shih Pei Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH COMPRESSIVE LAYERS
    • Publication number 20150263055
    • Publication date Sep 17, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chun-Han TSAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wafer Processing Method and Apparatus
    • Publication number 20150214082
    • Publication date Jul 30, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hui Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    3DIC Interconnect Apparatus and Method
    • Publication number 20150069619
    • Publication date Mar 12, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shih Pei Chou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR HAVING COMPRESSIVE LAYERS
    • Publication number 20130329102
    • Publication date Dec 12, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chun-Han TSAO
    • H01 - BASIC ELECTRIC ELEMENTS