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Chun Ho Choi

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  • Suwon-si, KR
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Wafer-level package and method of manufacturing the same
    • Publication number 20090085204
    • Publication date Apr 2, 2009
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Wook Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Device for coupling PCB sheet
    • Publication number 20050128724
    • Publication date Jun 16, 2005
    • Samsung Electro-Mechanics CO., LTD.
    • Bong Kyu Choi
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    Device for coupling PCB sheet
    • Publication number 20050128725
    • Publication date Jun 16, 2005
    • Samsung Electro-Mechanics CO., LTD.
    • Bong Kyu Choi
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    Device for coupling PCB sheet
    • Publication number 20050120549
    • Publication date Jun 9, 2005
    • Samsung Electro-Mechanics CO., LTD.
    • Bong Kyu Choi
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    Method and device for coupling PCB sheet
    • Publication number 20020152609
    • Publication date Oct 24, 2002
    • Samsung Electro-Mechanics CO., LTD.
    • Bong Kyu Choi
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL