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Chun Ho Yau
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Hong Kong, HK
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last 30 patents
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Patent Grant
Pre-plated leadframe having enhanced encapsulation adhesion
Patent number
7,691,679
Issue date
Apr 6, 2010
ASM Assembly Materials Ltd.
Yiu Fai Kwan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PRE-PLATED LEADFRAME HAVING ENHANCED ENCAPSULATION ADHESION
Publication number
20080233683
Publication date
Sep 25, 2008
Yiu Fai Kwan
H01 - BASIC ELECTRIC ELEMENTS