Chun Hong Wo

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,403,592
- Issue date Sep 3, 2019
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,786,625
- Issue date Oct 10, 2017
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,165,878
- Issue date Oct 20, 2015
- United Test & Assembly Center Ltd.
- Yong Bo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,087,777
- Issue date Jul 21, 2015
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20190348387
- Publication date Nov 14, 2019
- UTAC Headquarters Pte. Ltd.
- Yongbo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20180033759
- Publication date Feb 1, 2018
- UTAC Headquarters Pte. Ltd.
- Yongbo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE INTERCONNECT
- Publication number 20160233179
- Publication date Aug 11, 2016
- United Test & Assembly Center Ltd.
- Rui HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20160043041
- Publication date Feb 11, 2016
- UTAC Headquarters Pte. Ltd.
- Yong Bo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150325511
- Publication date Nov 12, 2015
- UTAC Headquarters Pte. Ltd.
- Yongbo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140264789
- Publication date Sep 18, 2014
- United Test & Assembly Center Ltd.
- Yongbo Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20140264792
- Publication date Sep 18, 2014
- United Test & Assembly Center Ltd.
- Yong Bo YANG
- H01 - BASIC ELECTRIC ELEMENTS

Chun Hong Wo

Person

Patents Grantslast 30 patents

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

RELIABLE INTERCONNECT

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES