Chun-Hua Chuang

Person

Hsin-Chu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor package structure
- Patent number 10,411,055
- Issue date Sep 10, 2019
- KINGPAK TECHNOLOGY INC.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing tilt of optical unit during manufacture of imag...
- Patent number 9,184,331
- Issue date Nov 10, 2015
- Kingpak Technology Inc.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging structure with black encapsulant
- Patent number 8,928,104
- Issue date Jan 6, 2015
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of molded image sensor packaging structure wit...
- Patent number 8,481,343
- Issue date Jul 9, 2013
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing tilt of transparent window during manufacturing...
- Patent number 8,450,137
- Issue date May 28, 2013
- Kingpak Technology Inc.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging structure with predetermined focal length
- Patent number 8,441,086
- Issue date May 14, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor structure and integrated lens module thereof
- Patent number 8,004,602
- Issue date Aug 23, 2011
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module package structure with supporting element
- Patent number 7,598,580
- Issue date Oct 6, 2009
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190074310
- Publication date Mar 7, 2019
- Kingpak Technology Inc.
- CHUN-HUA CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAG...
- Publication number 20130149805
- Publication date Jun 13, 2013
- KINGPAK TECHNOLOGY INC.
- Chun-Hua CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING TILT OF TRANSPARENT WINDOW DURING MANUFACTURING...
- Publication number 20120220065
- Publication date Aug 30, 2012
- KINGPAK TECHNOLOGY INC.
- Chun-Hua CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WIT...
- Publication number 20120068288
- Publication date Mar 22, 2012
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT
- Publication number 20110156188
- Publication date Jun 30, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH
- Publication number 20110156187
- Publication date Jun 30, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor structure and integrated lens module thereof
- Publication number 20090283809
- Publication date Nov 19, 2009
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS

Chun-Hua Chuang

Person

Patents Grantslast 30 patents

Sensor package structure

Method for reducing tilt of optical unit during manufacture of imag...

Image sensor packaging structure with black encapsulant

Manufacturing method of molded image sensor packaging structure wit...

Method for reducing tilt of transparent window during manufacturing...

Image sensor packaging structure with predetermined focal length

Image sensor structure and integrated lens module thereof

Image sensor module package structure with supporting element

Patents Applicationslast 30 patents

SENSOR PACKAGE STRUCTURE

METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAG...

METHOD FOR REDUCING TILT OF TRANSPARENT WINDOW DURING MANUFACTURING...

MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WIT...

IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT

IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH

Image sensor structure and integrated lens module thereof