Chun Hung Samuel IP

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Kwai Chung, HK

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Patents Applicationslast 30 patents

Information Patent Application
DIE ATTACHMENT APPARATUS AND METHOD UTILIZING ACTIVATED FORMING GAS
- Publication number 20150072473
- Publication date Mar 12, 2015
- Kui Kam LAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS...
- Publication number 20130119113
- Publication date May 16, 2013
- ASM Assembly Automation Ltd
- Kui Kam LAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR