Chun-Jen Weng

Person

Tainan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Support structure with sacrifice structure for light-emitting diode...
- Patent number 11,063,180
- Issue date Jul 13, 2021
- Prilit Optronics, Inc.
- Biing-Seng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum transfer device and a method of forming the same
- Patent number 10,804,134
- Issue date Oct 13, 2020
- Prilit Optronics, Inc.
- Biing-Seng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing spacer
- Patent number 7,235,491
- Issue date Jun 26, 2007
- United Microelectronics Corp.
- Chun-Jen Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming damascene structures
- Patent number 7,189,640
- Issue date Mar 13, 2007
- United Microelectronics Corp.
- Chun-Jen Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-filling process
- Patent number 6,833,318
- Issue date Dec 21, 2004
- United Microelectronics Corp.
- Chun-Jen Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with high heat dissipation
- Patent number 6,600,651
- Issue date Jul 29, 2003
- Macronix International Co., Ltd.
- Chun-Jen Weng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER SYSTEM AND A FIXTURE THEREOF ADAPTABLE TO PERFORMING LEVEL...
- Publication number 20240079253
- Publication date Mar 7, 2024
- Prilit Optronics, Inc.
- BIING-SENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SYSTEM AND A FIXTURE THEREOF ADAPTABLE TO PERFORMING LEVEL...
- Publication number 20220319881
- Publication date Oct 6, 2022
- Prilit Optronics, Inc.
- BIING-SENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM TRANSFER DEVICE AND A METHOD OF FORMING THE SAME
- Publication number 20200258767
- Publication date Aug 13, 2020
- Prilit Optronics, Inc.
- Biing-Seng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURE FOR LIGHT-EMITTING DIODE AND MANUFACTURING METHOD...
- Publication number 20190386176
- Publication date Dec 19, 2019
- Prilit Optronics, Inc.
- BIING-SENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SPACER
- Publication number 20060252190
- Publication date Nov 9, 2006
- Chun-Jen Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING DAMASCENE STRUCTURES
- Publication number 20060121730
- Publication date Jun 8, 2006
- Chun-Jen Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gap-filling process
- Publication number 20040097069
- Publication date May 20, 2004
- United Microelectronics Corp.
- Chun-Jen Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH HIGH HEAT DISSIPATION
- Publication number 20030147215
- Publication date Aug 7, 2003
- Chun-Jen Weng
- H01 - BASIC ELECTRIC ELEMENTS

Chun-Jen Weng

Person

Patents Grantslast 30 patents

Support structure with sacrifice structure for light-emitting diode...

Vacuum transfer device and a method of forming the same

Method of manufacturing spacer

Method of forming damascene structures

Gap-filling process

Package with high heat dissipation

Patents Applicationslast 30 patents

TRANSFER SYSTEM AND A FIXTURE THEREOF ADAPTABLE TO PERFORMING LEVEL...

TRANSFER SYSTEM AND A FIXTURE THEREOF ADAPTABLE TO PERFORMING LEVEL...

VACUUM TRANSFER DEVICE AND A METHOD OF FORMING THE SAME

SUPPORT STRUCTURE FOR LIGHT-EMITTING DIODE AND MANUFACTURING METHOD...

METHOD OF MANUFACTURING SPACER

METHOD OF FORMING DAMASCENE STRUCTURES

Gap-filling process

PACKAGE WITH HIGH HEAT DISSIPATION