Chun-Kai TZENG

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Metal bumps and method forming same
- Patent number 12,230,595
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for tuning via profile in dielectric material
- Patent number 12,136,644
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for tuning via profile in dielectric material
- Patent number 11,532,692
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic layer and method for f...
- Patent number 11,171,085
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hon-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bumps and method forming same
- Patent number 11,024,593
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for tuning via profile in dielectric material
- Patent number 10,910,466
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL BUMPS AND METHOD FORMING SAME
- Publication number 20250149485
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR TUNING VIA PROFILE IN DIELECTRIC MATERIAL
- Publication number 20240371915
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Bumps and Method Forming Same
- Publication number 20210288009
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Tuning Via Profile in Dielectric Material
- Publication number 20210151550
- Publication date May 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Tuning Via Profile in Dielectric Material
- Publication number 20200127078
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Kai Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Bumps and Method Forming Same
- Publication number 20200105696
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC LAYER AND METHOD FOR F...
- Publication number 20190355660
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hon-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Chun-Kai TZENG

Person

Patents Grantslast 30 patents

Metal bumps and method forming same

Process for tuning via profile in dielectric material

Process for tuning via profile in dielectric material

Semiconductor device structure with magnetic layer and method for f...

Metal bumps and method forming same

Process for tuning via profile in dielectric material

Patents Applicationslast 30 patents

METAL BUMPS AND METHOD FORMING SAME

PROCESS FOR TUNING VIA PROFILE IN DIELECTRIC MATERIAL

Metal Bumps and Method Forming Same

Process for Tuning Via Profile in Dielectric Material

Process for Tuning Via Profile in Dielectric Material

Metal Bumps and Method Forming Same

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC LAYER AND METHOD FOR F...